PCB Technical - Reliability Analysis and Failure Analysis of PCB Circuit Board

Reliability Analysis and Failure Analysis of PCB Circuit Board

With the development of electronic design in the direction of lightness and thinness, the high-density integration (HDI) technology in the PCB manufacturing process makes the terminal product design more miniaturized, while meeting the requirements of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital, automotive electronics and other products. HDI blind hole bottom cracks and other abnormalities are one of the reliability problems of high-density interconnect printed circuit boards. There are many influencing factors and they are not easy to be detected during the manufacturing process. The industry calls them typical gray defects, which often arrive after the terminal is installed. It was discovered that quality problems occurred, which led to large claims.
PCB circuit board reliability and environmental test analysis uses thermal shock, gas corrosion, HAST test, PCT test, CAF test, reflow soldering test and other aging test equipment,
The reliability of the PCB circuit board is only a failure analysis:
Mainly use mechanical grinding, argon ion polishing, FIB ion beam and other sample preparation methods, scanning electron microscope/transmission electron microscope, EDS energy spectrum and other analytical methods to analyze the bad and failed circuit board samples after the reliability test.

Common undesirable failure phenomena of PCB: failure analysis of coating open circuit, coating crack, coating cavity, columnar crystal, hole wall separation, etc. Jinjian Laboratory is for PCB board manufacturers, potion manufacturers and other customers, can provide coating open circuit, coating crack, coating cavity, Failure analysis of columnar crystals, hole wall separation, etc.; reliability analysis of thermal shock, reflow soldering, coating crystallization, coating coverage, etc.
01. Hot and cold shock
The Jinjian laboratory tests the thermal shock of PCB boards and detects resistance changes. Argon ion polishing or FIB cutting can be used to observe the cracks between the plating layers, the plating layer open circuit, the hole wall separation and other undesirable defects, which is a process improvement for the PCB board factory. Point out the direction.
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