PCB Technical - Factors affecting cost during SMT patch processing

ipcb has its own SMT chip factory, which can provide SMT chip processing services for 0201 components in the smallest package, and supports processing with incoming samples and PCBA OEM materials. Next, I will introduce the impact of SMT chip processing. The cost factor.

PCBA processing

Advantages of SMT processing
SMT processing is essentially the technology of soldering the components to the PCB light board through related machinery and equipment. Although the expenditure on the cost of the machine is relatively large, it has its own unique advantages and characteristics compared with the traditional plug-in assembly. This technology has many advantages, such as the overall PCBA processing efficiency and the miniaturization of components. And miniaturization of finished product volume. Because the machine can be produced in large quantities, it greatly increases the cost increase and inefficiency caused by labor-related restrictions, which is a technological upgrade for the development of the entire electronics manufacturing industry.

The main stages involved in the SMT patch processing process
1. Solder paste printing
2. Solder paste inspection
3. Patch processing
4. Manual inspection
5. Reflow soldering
6. In (offline) AOI test
7. X-RAY detection
8. Functional test

SMT processing factory

Factors affecting cost during SMT patch processing
1. Solder Paste Printing
The process involves placing an accurate amount of solder paste on the pads of the components to be soldered. For this reason, it is not only important that the solder paste is applied properly, but it is also important to store it properly at low temperatures and return to room temperature before applying it. In addition, you also need to pay attention to the scraping angle and speed.

2. Solder paste inspection
This step is very helpful in reducing costs, because it helps to find SMT soldering defects early. What it enables you to do is prevent costly defects in the later stages of manufacturing.

3. Patch processing
An important part of the SMT assembly process, which is completed by the placement machine. Although small components are mounted by high-speed placement machines, larger components require multi-function placement machines that run at low speeds.

4. Manual visual inspection
The visual inspection process once again ensures that any defects can be found early. Some of the errors that can be identified at this stage include any missing parts or lack of proper placement. After reflow soldering, it will be difficult to deal with these defects. Once again, this stage of SMT assembly allows cost control, as if this stage has not been implemented, you can expect to correct errors later and production costs will rise.

5. Reflow soldering
This process involves melting the solder paste so that the component can be connected to the circuit board. The temperature profile setting determines the reflow soldering ability and also reduces the production cost. Professional assemblers can control costs to a large extent.

6. Automatic optical inspection
At this stage, the performance of the solder joints is thoroughly checked. Some errors that can be detected at this stage include:
Tombstone, few pieces, dislocation, bridging, virtual welding, etc.

7. X-ray detection
Once again, X-ray inspection is a good way to ensure that products are efficient and do not have to contend with product defects after they are placed on the market.

8. ICT or functional testing
Functional testing will continue to test the functions of the assembled PCB to ensure that the final product is very reliable.

SMT processing

SMT chip processing capability
1. The largest board: 310mm*410mm (SMT);
2. Maximum board thickness: 3mm;
3. Minimum board thickness: 0.5mm;
4. The smallest Chip parts: 0201 package or parts above 0.6mm*0.3mm;
5. The maximum weight of mounted parts: 150 grams;
6. Maximum part height: 25mm;
7. Maximum part size: 150mm*150mm;
8. Minimum lead part spacing: 0.3mm;
9. The smallest spherical part (BGA) spacing: 0.3mm;
10. The smallest spherical part (BGA) diameter: 0.3mm;
11. Maximum component placement accuracy (100QFP): 25um@IPC;
12. Mounting capacity: 3 to 4 million points/day.

Why choose ipcb for SMT patch processing?
1. Strength guarantee
▪ SMT workshop: It has imported placement machines and multiple optical inspection equipment, which can produce 4 million points per day. Each process is equipped with QC personnel, who can keep an eye on product quality.
▪ DIP production line: There are two wave soldering machines. Among them, there are more than ten old employees who have worked for more than three years. The workers are highly skilled and can weld all kinds of plug-in materials.

2. Quality assurance, high cost performance
▪ High-end equipment can paste precision shaped parts, BGA, QFN, 0201 materials. It can also be used as a model for mounting and placing bulk materials by hand.
▪ Both samples and large and small batches can be produced. Proofing starts at 800 yuan, and batches start at 0.008 yuan/point, and there is no start-up fee.

3. Rich experience in SMT and soldering of electronic products, stable delivery
▪ Accumulated services to thousands of electronic companies, involving SMT chip processing services for various types of automotive equipment and industrial control motherboards. The products are often exported to Europe and the United States, and the quality can be affirmed by new and old customers.
▪ Delivery on time, normal 3-5 days after the materials are complete, and small batches can also be shipped on the same day.

4. Strong maintenance ability and perfect after-sales service
▪ The maintenance engineer has rich experience and can repair the defective products caused by all kinds of patch welding, and can ensure the connection rate of each circuit board.
▪ 24-hour customer service staff will respond at any time and solve your order problems as quickly as possible.