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Now that the market competition is becoming more and more fierce, the first point for PCB assembly plants to remain invincible in such an environment is to reduce their production costs. To achieve this goal, the main method is to achieve it by improving the production efficiency of the production line.
1. Placement procedure processing
The SMT production line is composed of multiple equipment, including screen printing machine, placement machine, reflow soldering, etc., but in fact the speed of the production line is determined by the placement machine. An SMT production line usually includes a high-speed machine and a high-precision placement machine. The former mainly mounts chip components, while the latter mainly mounts ICs and special-shaped components. When the time for the two placement machines to complete a placement process (hereinafter referred to as the placement time) is equal and small, the entire SMT production line has a large production capacity. In order to achieve this goal, we can deal with the placement process as follows.
Load distribution is balanced. Reasonably allocate the number of components to be mounted on each device, and try to make the mounting time of each device equal.
When we first allocate the number of components to be placed on each device, there will often be a large gap in the placement time. This requires that the production load of all equipment on the production line be adjusted according to the placement time of each device, and the placement Some components on the longer equipment are moved to another equipment to achieve a balanced load distribution.
Equipment optimization. Each placement machine has a large placement speed value, for example, YAMAHA's YV100 is called 0.25 seconds/piece, but in fact this speed value must be realized under certain conditions. Optimizing the numerical control program of each device is to make the placement machine meet these conditions as much as possible in the production process, so as to achieve high-speed placement and reduce the placement time of the equipment. The principle of optimization depends on the structure of the device. For the placement machine of X/Y structure, it is usually optimized according to the following principles.
2. Try to make the placement head pick up components at the same time
When arranging the placement program, arrange the components of the same type together to reduce the number of nozzle changes when the placement head picks up components and save placement time. The feeder with more picking times should be placed on the material station close to the printed board. During a pick-and-place cycle, try to take materials only from the front or rear material stations to reduce the moving distance of the placement head. During each pick and place cycle, the placement head must be fully loaded.
Some principles will be contradictory when optimizing the program, which requires compromise consideration in order to select a good optimization plan. Optimization software can be used in load distribution and equipment optimization. The optimization software includes equipment optimization procedures and production line balancing software. The optimization program of the equipment is mainly optimized for the placement program and the configuration of the feeder. After obtaining the component BOM table and CAD data, the placement program and feeder configuration table can be generated. The optimization program will optimize the movement path of the placement head and the configuration of the feeder to minimize the placement of the head. Move the distance to save mounting time. The production line balance software is an effective tool for optimizing the entire production line. The optimization software uses a certain optimization algorithm. The current optimization software has a certain degree of intelligence and can complete the optimization process quickly and well.
The SMT patch processing production line is composed of multiple automated equipment. When the speed of a certain equipment is slower than other equipment, then this equipment will become a bottleneck restricting the increase in the speed of the entire SMT production line. According to a sample of 19 factories, the bottleneck often appears on the placement machine, and the only way to eliminate the bottleneck phenomenon is to increase the placement machine. Of course, this requires a large capital investment, but this can make full use of the excess production capacity of other equipment, which is far more cost-effective than investing in another SMT production line. Which type of placement machine to add depends on the bottleneck of the production line. Under normal circumstances, it is better to purchase a high-speed, multi-functional placement machine, because it has the characteristics of both high-speed and high-precision machines. PCB placement components The scope covers high-precision machines and high-speed machines, and it can solve the bottleneck problem caused by high-speed machines or high-precision machines. The current development trend of placement machines is also developing in this direction to meet the needs of the market.
