PCB Technical - What factors need to be considered in the production of multi-layer circuit boards

What factors need to be considered in the production of multi-layer circuit boards

At present, in the field of electronic product processing, multilayer circuit boards are indispensable as one of the important electronic components. At present, there are many types of PCB circuit boards, such as high-frequency circuit board plates, microwave circuit boards and other types of printed circuit boards that have gained a certain reputation in the market. Multilayer circuit board factories have specific processing techniques for various board types. But in general, multilayer circuit board manufacturers need to consider three major aspects.

1. Consider the choice of process flow

The production of multi-layer circuit boards is easily affected by many factors, and the number of layers, punching process, surface coating treatment and other technological processes will all affect the quality of the finished PCB circuit board. Therefore, for these process environments, the production of multilayer circuit boards is fully considered in combination with the characteristics of the production equipment, and can be flexibly adjusted according to the types of PCB boards and processing requirements.

2. Consider the choice of substrate

The substrates of circuit boards can be divided into two categories: organic materials and inorganic materials. Each material has its own unique advantages. Therefore, the determination of the type of substrate considers various properties such as dielectric properties, copper foil type, thickness of the base groove, and processability characteristics. Among them, the thickness of the surface copper foil is a key factor affecting the performance of this printed circuit board. Generally speaking, the thinner the thickness, the more convenient the etching and the improvement of the precision of the graphics.

3. Consider the setting of the production environment

The environment of the multi-layer circuit board manufacturing workshop is also a very important aspect, and the regulation of ambient temperature and ambient humidity are both crucial factors. If the ambient temperature changes too significantly, it may cause the holes on the base plate to break. If the environmental humidity is too high, nuclear energy will have an adverse effect on the performance of the substrate with strong water absorption, specifically in terms of dielectric properties. Therefore, it is very necessary for circuit board manufacturers to maintain proper environmental conditions during production.

In summary from the above description, it is necessary to consider the choice of substrate, the setting of the production environment, and the choice of process flow when the circuit board is processed and manufactured. At the same time, the processing and cutting methods of the engineering materials of the PCB circuit board are also an aspect that needs to be carefully selected, which is closely related to the smoothness of the printed circuit board finished product.

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