PCB Technical - What factors need to be considered in the processing and production of multi-layer circuit boards

What factors need to be considered in the processing and production of multi-layer circuit boards

At present, in the field of electronic product processing, multilayer circuit boards are indispensable as one of the important electronic components. At present, there are many types of PCB circuit boards, such as high-frequency circuit board plates, microwave PCB boards and other types of printed circuit boards have gained a certain reputation in the market. Multilayer circuit board factories have specific processing techniques for various board types. But in general, PCB processing and production are three aspects that need to be considered.

1. Consider the choice of substrate

The base material of the circuit board can be divided into two types: organic material and inorganic material, each material has its own unique advantages. Therefore, the determination of the type of substrate considers various properties such as dielectric properties, copper foil type, base groove thickness, and processability characteristics. Among them, the thickness of the surface copper foil is a key factor affecting the performance of this printed circuit board. Generally speaking, the thinner the thickness, the more convenient the etching and the improvement of the precision of the graphics.

2. Consider the choice of process flow

The production of multi-layer circuit boards is easily affected by many factors, and the number of processing layers, perforation technology, surface coating treatment and other processes will affect the quality of the finished PCB circuit board. Therefore, for these process environments, the processing and production of multilayer circuit boards are fully considered in combination with the characteristics of the production equipment, and can be flexibly adjusted according to the types of PCB boards and processing requirements.

3. Consider the setting of the production environment

The environment of the multi-layer circuit board processing workshop is also a very important aspect. The regulation of the environmental temperature and the environmental humidity are both crucial factors. If the ambient temperature changes too significantly, it may cause the holes on the base plate to break. If the environmental humidity is too high, nuclear energy will have an adverse effect on the performance of the substrate with strong water absorption, specifically in terms of dielectric properties. Therefore, it is necessary to maintain proper environmental conditions during the processing and production of multilayer circuit boards.

In summary from the above description, the choice of substrate, the setting of the production environment, and the choice of process flow need to be considered when making the circuit board. At the same time, the processing and blanking methods of the engineering materials of the PCB circuit board are also an aspect that needs to be carefully selected, which is closely related to the smoothness of the finished circuit printed circuit board.