DPC ceramic substrate

DPC (Direct Plate Copper) ceramic substrate, also known as direct copper-plated ceramic substrate, is a new type of ceramic substrate that combines thin film circuit and electroplating process technology. It is not only used in traditional lighting such as stage, landscape and car headlights, but also in the packaging of high-power components such as vertical cavity surface emitting lasers (vcsel), and also includes ultraviolet light emitting diodes (UV LED) and other fields. In short, the DPC ceramic substrate, which combines the advantages of ceramic processing technology and material technology, will have many characteristics such as high thermal conductivity, high insulation, high circuit accuracy, high surface flatness, and thermal expansion coefficient matching with the chip.

DPC ceramic substrate is a new process product developed with the development of high-power and small-size integrated circuits. Therefore, it can be said that this product will occupy a leading position in the ceramic substrate industry in the future.

DPC ceramic substrate features: high thermal conductivity, high insulation, high circuit resolution, high surface flatness, and high metal-ceramic bonding.

The package substrate is the key link to connect the internal and external heat dissipation paths. It can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the size of packaged products, improve electrical performance and heat dissipation, and ultra-high density Or the purpose of multi-chip modularization.

With the continuous upgrading of technology in recent years, the input power of the chip has become higher and higher. For high-power products, the package substrate requires high electrical insulation, high thermal conductivity, and thermal expansion coefficient matching the chip. In the past, it was packaged on a metal PCB board, and an insulating layer was still needed to realize thermoelectric separation. Due to the extremely poor thermal conductivity of the insulating layer, the heat is not concentrated on the chip at this time, but it is concentrated near the insulating layer under the chip. Once higher power is used, heat dissipation problems will emerge. This obviously does not match the direction of market development.

PCB ceramic bracket, PCB ceramic substrate

The DPC ceramic substrate can solve this problem, because the ceramic itself is an insulator and has good heat dissipation performance. The DPC ceramic circuit board can directly fix the chip on the ceramic, so there is no need to make an insulating layer on the ceramic.

DPC ceramic substrates also have various advantages

Low communication loss-the dielectric constant of the ceramic material itself makes the signal loss smaller.

High thermal conductivity-the thermal conductivity of alumina ceramics is 15～35 w/mk, and the thermal conductivity of aluminum nitride ceramics is 170～230 w/mk. The heat on the chip is directly conducted to the ceramic sheet without an insulating layer., Can achieve relatively better heat dissipation.

A more matching thermal expansion coefficient-the material of the chip is generally Si (silicon) GaAS (gallium arsenide), and the thermal expansion coefficient of ceramics and the chip are close, and will not produce too much deformation when the temperature difference changes drastically, causing problems such as wire unsoldering, internal stress, etc. .

High bonding strength-The bonding strength between the metal layer and the ceramic substrate of the Stone ceramic circuit board product is high, and the maximum can reach 45MPa (the strength of the ceramic sheet with a thickness of more than 1mm).

Pure copper through holes-Stone ceramic DPC process supports PTH (plated through holes) / Vias (vias).

High operating temperature-ceramics can withstand high and low temperature cycles with large fluctuations, and can even operate normally at a high temperature of 600 degrees.

High electrical insulation-the ceramic material itself is an insulating material and can withstand a high breakdown voltage.

Customized service--Silicom can provide customized services according to customer needs, and conduct mass production according to the product design drawings and requirements given by users. Users can have more choices and be more humane

.

DPC substrate process, using thin film manufacturing technology-vacuum coating method to sputter and bond to the copper metal composite layer on the ceramic substrate, so that the copper and the ceramic substrate have a super bonding force, and then use the photoresist of yellow light micro-shading to be re-exposed, developed, The etching and film removal process complete the circuit production, and finally increase the thickness of the circuit by electroplating/electroless plating. After the photoresist is removed, the metallized circuit production is completed.

DPC ceramic substrate is more in line with the future development direction of high density, high precision and high reliability. For PCB manufacturer, DPC ceramic substrate is a more feasible choice. IPCB will continue to work hard to create high-quality products, provide customers with more satisfactory products and services, and achieve win-win cooperation with customers.