LED Ceramic PCB,Ceramic Substrate PCB

Ceramic Based PCB is a kind of printed circuit board. Different from traditional FR-4 or aluminum substrate, it has thermal expansion coefficient close to semiconductor and high heat resistance. It is suitable for products with high calorific value (high brightness LED, solar energy), and its excellent weather resistance is more suitable for harsh outdoor environment.

Ceramic substrate PCB features:

Structure: excellent mechanical strength, low warpage, thermal expansion coefficient close to silicon wafer (aluminum nitride), high hardness, good processability, high dimensional accuracy

Climate: suitable for high temperature and high humidity environment, high thermal conductivity, good heat resistance, corrosion and abrasion resistance, anti UV & yellowing

Chemistry: lead free, non-toxic, good chemical stability

Electrical property: high insulation resistance, easy metallization, strong adhesion between circuit graphics and it

Market: rich materials (clay, aluminum), easy to manufacture, low price

Comparison of thermal properties (conductivity) of PCB materials:

Glass fiber substrate (traditional PCB): 0.5w/mk, aluminum substrate: 1 ~ 2.2w/mk, ceramic substrate: 24 [alumina] ~ 170 [aluminum nitride] W / MK

Material thermal conductivity (unit: w / MK)

Resin: 0.5, alumina: 20-40, silicon carbide: 160, aluminum: 170, aluminum nitride: 220, copper: 380, diamond: 600

Ceramic substrate process classification:

It can be divided into thin film, thick film, low temperature co fired multilayer ceramics (LTCC)

Thin film process (DPC): precise control element circuit design (line width and film thickness)

Thick film: provide heat dissipation and weather resistance

Low temperature co fired multilayer ceramics (HTCC): the glass ceramics have the characteristics of low sintering temperature, low melting point, high conductivity, and can be co fired with precious metals to realize multilayer ceramic substrate) and structure.

LTCC: stack several ceramic substrates and embed passive components and other ICs

The characteristics of AlN and alumina were compared:

Alumina: easy to obtain materials, low cost, simple process, poor thermal conductivity

Aluminum nitride: the material is not easy to obtain, the cost is high, the process is difficult, and the thermal conductivity is better