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Model : Aluminum nitride ceramic PCB
Material : Ceramic PCB, Ceramic Substrate
Layer : 2Layer Ceramic PCB
Color : White
Thickness : Aluminum nitride 0.635mm
Copper Thickness : 1OZ(35um)
Surface Treatment : Immersion Gold
Gold thick : >=3U"
Minimum aperture : 0.8mm
Process features : through hole, ceramic dam technology
Superior electrical and physical properties make ceramic substrate PCB more and more popular
The thermal conductivity is 20-200w / m.k (20-200 times of aluminum based copper substrate), and the dielectric withstand voltage is 17000v / mm (17 times higher than that of other circuit boards);
The surface roughness of ceramic board is 0.2-0.7um;
The compressive strength is more than 450MPa (higher than any PCB made of any material), and it has good electrical performance in various harsh environments (high temperature, high humidity, high pressure and high corrosion)
ceramic substrate PCB
ipcb circuit company can process 3 mil / 3 mil precision circuit, 0.01-0.5 mm conductor thickness, micro hole filling, inorganic dam enclosure technology, 3D circuit, etc;
The thickness that ipcb circuit company can process: 0.25, 0.38, 0.5, 0.635, 1.0, 1.5, 2.0, 2.5, 3.0 mm, etc;
ipcb circuit company can process various surface treatments: gold plating process 1-30u, nickel palladium process 1-5u, silver plating process (3-30um), nickel plating process (3-10um), tin deposition process (1-3um).
Model : Aluminum nitride ceramic PCB
Material : Ceramic PCB, Ceramic Substrate
Layer : 2Layer Ceramic PCB
Color : White
Thickness : Aluminum nitride 0.635mm
Copper Thickness : 1OZ(35um)
Surface Treatment : Immersion Gold
Gold thick : >=3U"
Minimum aperture : 0.8mm
Process features : through hole, ceramic dam technology
For PCB technical problems, iPCB knowledgeable support team is here to help you with every step. You can also request PCB quotation here. Please contact E-mail sales@ipcb.com
We will respond very quickly.
