Дизайн PCB - норма проектирования платы

Circuit board design specification-thick copper board design specification

для платы печатная плата толщиной меди более 2 унций, из - за толщины меди, конструкционные нормы платы отличаются от обычных схем. с этой целью компания разработала специальную инструкцию по проверке документов для толстой бронзы, с тем чтобы клиенты могли обеспечить более качественное качество платы.

1: инструкции по проектированию проводов плата цепи design
A: The minimum wire width of the плата цепи не менее 0.3mm;
B: In general, the distance between adjacent wires should not be less than 0.25mm
C: The copper foil around the fixing hole is not less than 0.расстояние до края отверстия 4 мм; не должно быть тонких ниток.5mm from the edge of the hole
E: Whether to consider low-density wiring design
F: Whether the wires are laid out according to the shortest route, and whether there will be no sharp angles at the turn
G: Whether the junction between the wire and the pad is smoothed into a slope
H: In the power circuit, the distance between adjacent wires between hot and cold ground should not be less than 6mm
I: The distance between the wire and the edge of the printed board is generally not less than 3mm, особенно не менее 1.5mm, Но ширина подключения не должна быть меньше 1.5mm; the ground wire must not be less than 0.5mm

2: режим проектирования планшета для проектирования платы

A: The distance between the pad of the interposing component and the edge of the printed board is generally not less than 7mm, особенно не менее 3.5mm. The distance between the pad and the edge of the mounted component should not be less than 5mm; The physical and pad distance of the interposing component or the mounting component should not be less than 5mm from the edge of the board
B: For ICs with a 1.шаг 78 мм, the connection (pad) pitch should not be less than 0.3mm
C: The minimum diameter of the circular pad, whether it meets the standard
D: After the wave soldering of the components inserted, whether the pads are driven away from the tin bath
E: There must be no connection between the pads, between the pads and the exposed copper foil
F: Whether the pads of the switching transformer and the harmonic current suppressor are removed from the empty pads to prevent mis-insertion
G: The filter inductance of the AC input circuit, прокладка переключателя, inverter transformer, мощный резистор, high-power damping or rectifier straddle diode (non-plastic package), and rectifier large electrolytic capacitor are reinforced with rivets
H: The number of rivet pads of multi-pin component pads, обычно не менее 1/2 of the number of pins of the component
I: Whether the design requirements of the rivet hole pad meet the standard; the rivet pad with a 1.8mm диафрагма 4.5mm. если не отвечает требованиям, a 4.необходимо использовать прокладку калибра 0 мм, и необходимо каплевидное усиление верхнего олова. The rivet pad with a 2.диаметр отверстия 4 мм 5 мм.5mm, если не, использование.0mm pad and add drop-shaped upper tin reinforcement
J: Take the printed board positioning hole as the center, не сконструированная прокладка в радиусе 7 мм, and rivet pads are not designed for adjacent holes with a distance of less than 6mm
H: Whether the key components are reinforced with rivets, and whether the pads of the key components are tinned with water droplets

3: Thermal design specifications for плата цепи design

A: Whether the thermal element is far away from the heat sink
B: Are there heat dissipation measures for high-power components?
C: The distance between the high-power heating device and the large-volume electrolytic capacitor must be greater than 5mm
D: Have you considered the heat conduction facilities of the device?
е: удобно ли для установки и расположения радиаторов?
F: The heating device should have a proper amount of heat dissipation holes under and around the corresponding printed board, and the diameter is generally not greater than 4mm
G: Large-area copper foil is easy to be heated to produce copper foil expansion, and the area exceeds the diameter of the 15mm circle, the conductive layer must be opened with a conductive window

4: режим проектирования планировки схем

A: Is it possible to complete production through the simplest assembly process?
B: Whether the layout of the high-power devices is uniform, рассмотреть поток теплоотвода, and the board strength
C: Is the fixing device added to the high-quality device?
D: вы рассматривали изоляционные меры оборудования?
E: Whether the arrangement of components is horizontal or vertical
F: The radiator must not touch the surrounding components
G: Whether the design of the cushion position is evenly distributed
H: Whether there are nail bottom components and flying leads
I: Whether the heat sink installation complies with the heat dissipation flow direction, and whether to use the existing heat sink as much as possible to reduce the possibility of making a new heat sink
J: Whether the maximum печатная плата board length is not more than 600mm, and the width is not more than 360mm
K: Are there grounding lugs at the fixed holes for cold ground installation? достаточно ли заземления?
L: Whether there are more than three global Mark points on the copper foil surface of the board, and whether the increased position meets the process requirements and affects the safety distance
M: Whether the arrangement of the vertical electrical plug-in components can ensure that the outer edge distance between the pieces is more than 1mm
N: Whether there are solder pads and copper foil on the edge of the printed board, making assembly more difficult
O: Whether the vertical board considers the fixing method
P: Whether the components fixed on the heat sink leave a space that can be disassembled without disassembling the heat sink
Q: Are there tall and dense components or sharp radiator corners around the power strip?
R: Whether the placement position of the input and output power strips meets the convenience of connecting with other boards of the whole machine
S: Whether the SMD components are placed perpendicular to the long side of the board to avoid fracture or damage due to deformation
T: Whether the plug-in IC and the chip IC are placed horizontally and the direction of the wave soldering is consistent with the wave soldering process, and whether the IC is designed with tin-theft pads in the appropriate position during the wave soldering to avoid continuous soldering of the soldering pads
U: Whether to consider avoiding shadow effects when placing all SMD components
V: Is there any positional interference between the screws of the fixed components and the radiator and the components on the board?

5: режим проектирования сварки плата цепи design
A: Whether there is a 3mm wide reserved bracket position in the middle of the печатная плата board that is wider than 180mm or longer than 320mm through wave soldering
B: The reserved position of the support bar should not be within the bending range of the component lead
C: Components that are not suitable for wave soldering due to structural limitations, необходимо добавить оловянную канавку в противоположное положение вершины волны, and the slot width is 0.7mm
D: The direction of wave soldering needs to be clearly marked on the upper and lower sides of the board
E: Try not to lay out components like horizontal plug-in wires that extend out of the edge of the board.
изгиб проводов электрических разъёмов, the area around the triode, прокладка на интегральных схемах и штепсельных пятах, should be coated with a secondary solder mask
G: A large area of copper foil is easy to be heated to produce copper foil expansion, Таким образом, площадь больше 15 мм окружности диаметр, the conductive layer needs to open a conductive window or grid