RT Duroid6035 High Frequency RF PCB

RT/Duroid 6035HTC PCB Material

RT/Duroid 6035htc is a ceramic filled polytetrafluoroethylene component high frequency circuit material designed for high power RF microwave applications.

2.4 times the thermal conductivity and long-term thermal stability of the RT/Duroid 6000 series copper foil (electrolytic copper and reverse copper) makes the RT / Duroid 6035htc laminate an extraordinary choice for high-power RF applications.

Rogers' advanced filler system makes it highly drillable, and the cost of drilling is greatly reduced compared with the standard high thermal conductivity material using hard alumina filler.

Main advantages

High thermal conductivity

The increased heat dissipation of the electrolyte significantly reduces the operating temperature for high-power applications

Low loss loss factor

Excellent high frequency performance

Thermally stable low roughness reverse copper

Lower insertion loss and excellent thermal stability

Advanced filling system

Compared with the material containing alumina filler, the service life of drilling tool is greatly prolonged

Applications

High power RF and microwave amplifiers, Power amplifier, coupler, filter, combiner and power divider

Real Project display:

Duroid ™ 6035HTC laminate is a ceramic filled ptfe high frequency circuit material with high thermal conductivity and is designed for high power rf and microwave applications.

Duroid 6000 laminate also has excellent electronic performance and is widely used for high reliability and aerospace applications.All Rogers materials are RoHs compliant.

Rogers 6035htc Technical Specifications

For more technical information about rogers 6035htc, please visit: Rogers 6035htc Technical Specifications

RF/Microwave PCB application

PCB printed circuit boards with radio frequency(RF PCBs) are an increasingly used technique within the PCB industry.

--RF PCB with a high frequency with works above 100 MHz.

--Microwave PCB with works above 2 GHz radio frequency.

RF-pcb’s are used in different applications such as remote controls(wireless controls)security,smartphones,sensors etc.

New technologies make more and more use of these RF applications.

This asks for a manufacturing according to high quality standards and choosing the right RF materials depending on the application.

It is important that one knows the properties of the various materials.Choosing the right material is perhaps the most critical decision in the production process of the RF PCB.