PCBA Tech - SMT patch market SWOT analysis and SMT DIP plug-in

SWOT analysis and forecast of SMT patch market

"SMT Patch Inspection Equipment Market Forecast Report 2021-2027" briefly outlines current trends, growth opportunities and industry constraints. The report provides key information about the outstanding advantages of SMT patch testing equipment market manufacturers in the market, and is a valuable source of guidance and guidance for companies and individuals interested in the industry. The report focuses on the current market conditions of SMT patches, the demand status of SMT patches, the business strategies used by major players, and important factors in the future prospects of the industry.

SWOT analysis and forecast of SMT patch market in 2021

The SMT patch inspection equipment market is expected to grow at a compound annual growth rate of 4.1%, with revenue of USD 450.95 million during the forecast period.

The main purpose of the SMT patch inspection equipment market report is to provide detailed information about the industry based on detailed evaluation and in-depth evaluation of the business. The natural refrigerant market has been appropriately divided into important market segments according to types and uses. It also provides a detailed industry overview of the market size of SMT patch inspection equipment.

Break down by type:

-Electronic consumption

Equipment-Telecom

-car

-LED

Screen-Medical Equipment-Aviation

aerospace-

Military/defense

The main points of SMT placement discussed in the report are the main market participants participating in the market, such as manufacturers, raw material suppliers, equipment suppliers, end users, traders, distributors, etc. Mentioned the company's full profile. The report also includes capacity, production, price, revenue, cost, gross profit margin, gross profit margin, sales volume, sales revenue, consumption, growth rate, import, export, supply, future strategy and their ongoing SMT patch technology development.

SMT DIP plug-in processing flow

We can simply understand that DIP plug-in is a link in the electronic manufacturing process. There are manual DIP plug-ins and AI machine DIP plug-ins. Insert the specified material into the specified position. The manual DIP plug-in also has to go through wave soldering to solder the electronic components on the board.

DIP plug-in (Dual In-line Package), also known as DIP packaging in Chinese, or dual in-line packaging technology, refers to integrated circuit chips packaged in dual in-line form. Most small and medium-sized integrated circuits use this For this type of package, the number of pins generally does not exceed 100. The DIP packaged CPU chip has two rows of pins, which need to be inserted into the chip socket with the DIP structure. Of course, it can also be directly inserted into a circuit board with the same number of solder holes and geometric arrangement for soldering. The DIP packaged chip should be especially careful when plugging or unplugging from the chip socket to avoid damage to the pins. DIP package structure forms are: multilayer ceramic double in-line DIP, single-layer ceramic double in-line DIP, lead frame DIP (including glass ceramic sealing type, plastic encapsulation structure type, ceramic low-melting glass encapsulation type) Wait.

The process flow of DIP plug-in processing can generally be divided into: component forming processing - plug-in - wave soldering - component cutting foot - repair welding (post welding) - washing board - function test

Now with the rapid development of SMT processing technology, SMT chip processing has a tendency to gradually replace DIP plug-in processing. However, due to the large size of some electronic components in PCBA production, plug-in processing has not been replaced and is still in electronic assembly. The processing process plays an important role. DIP plug-in processing is after SMT patch processing, and assembly line manual plug-ins are generally used, which requires more employees.