PCBA Tech - SMT patch treatment measures to improve material loss

Material loss during SMT patch production and processing has always been one of the key controls of production managers, and it is also a problem that needs continuous improvement. Although the industry has been developing for decades, there are still many aspects that need to be improved and controlled. Especially in today's increasingly fierce competition, it is particularly important to control material loss.

SMT patch treatment measures to improve material loss

The control and management of SMT chip processing material loss are mainly divided into two aspects:

Material management and control:

Good management is required whether it is provided to customers or purchased by yourself. This is an important principle to ensure material safety and normal production.

1. The feed quantity is incorrect, and the feed quantity is incorrect.

Improvement method: In addition to complete packaging, all unopened materials and all other incoming materials will be counted in detail, and inventory points will be used to ensure the accuracy of incoming data.

2. Quality requirements, unreasonable purchase packaging, different material sizes, poor appearance, and different pins.

Improvement method: IQC checks all materials before storage, and PASS guarantees the quality. The storage must be good, and the packaging must meet the requirements.

3. Material confusion, customer composition, household goods and customer materials confusion.

Improvement method: separate warehouse management, formulate and improve warehouse management process, classify and store all materials, and clearly mark them.

4. The material placement time exceeds the material service life and becomes a stagnant material, and the waste is reported.

Improvement method: release and use all materials in strict accordance with the principle of "first in, first out", and control the early warning mechanism of the material cycle.

5. The humidity in the warehouse is very high, and the materials absorb moisture in the air, resulting in poor material recovery.

Improvement method: use electronic thermometers and hygrometers to monitor whether the temperature and humidity of the warehouse meet the requirements in real time, check twice a day, and increase air conditioning and ventilation equipment.

6. The operation error causes the inventory data discrepancy, and the inventory data does not match the actual situation.

Improvement method: Warehouse data can be controlled by intelligent warehouse management systems (such as ERP and MES) to ensure that the "subject" and "object" are consistent;

7. Repair consumables and report waste loss.

Improvement methods: develop maintenance materials, inform waste management mechanisms, lead the recall process, use old materials and reduce losses.

In the process of SMT patch processing, the above-mentioned management is the basis for reducing material loss, and it is also an indispensable requirement for material control. If it is not done well, it is necessary to strengthen the control of material loss.

Process control:

SMT patch production process through document specification, operation training, process management, material use control, thereby reducing material loss in the production process.

1. Defective paper feeder, such as dirty paper, deformed cover, jammed gear, etc., causing material loss.

Improvement method: Regular maintenance of the paper feeder, and maintenance documentation. The maintenance personnel follow the document requirements one by one, and require maintenance records and confirmations to ensure the correct use of the online feeder.

2. The nozzle is defective, such as: nozzle warpage, blockage, damage, vacuum leakage, poor material recovery, poor image recognition and casting.

Improvement method: maintain the cigarette holder regularly, and require technicians to check the equipment every day, test the nozzle center and maintain the equipment regularly as planned.

3. The operator's receiving operation is not standardized. For example, the material is not installed correctly, thrown out and twisted the material.

Improvement method: create operation standard files, graphic display, operator induction training, and regularly check the operator's work effect.

4. The receiving port is not good. When you connect the machine to the receiving port, the receiving port will always drop.

Reinforcement method: use adhesive tape or copper tape.

5. Material loss, the order has been offline, resulting in material loss.

Improvement method: Train the operator to protect the material before the feeder and protect it after removing the material. You can use masking glue to paste the material.

6. Insufficient vacuum pressure and poor vacuum (oil stains on the pipeline).

Improvement method: develop a checkpoint mechanism. Every day there are special personnel to conduct inspections according to requirements, and some people will conduct inspections.

7. The operator did not carefully turn the circuit board over.

Improvement method: The documentation requires engineers to make the marking points foolproof by making printer/installer programs, and to check them by searching IPQC.

8. The production of fork plates causes loss of fork plate materials.

Improvement method: The engineer skips the fork plate program, another engineer helps to check, and paste one or two at the same time to confirm whether the fork plate has material.

9. When the material is wrong, the material is wrong when replacing the product.

Improvement method: two operators inspect all materials, IPQC inspects the materials, produces cardboard, and produces the first functional part.

10. The wrong material is received, that is, the operator does not care about the wrong material or the wrong material during the operation.

Improvement method: formulate refueling procedures, make refueling records, check IPQC materials, and measure values.

11. More expensive production lines, such as PCBs, IC chips, structural parts, and molded parts.

Improvement method: All valuable materials are required to be delivered to the production line at a ratio of 1:1, and delivered to the white night shift, and record the release and delivery records.

12. Uneven materials, rusty pins and other substandard products will cause poor recognition.

Improvement method: feedback IQC to communicate with suppliers to replace materials and compensate for losses.

13. The film is too sticky and the material will stick to the tape when rolled up. The film is wider than the slit, and the paper feeds badly.

Improvement method: Replace the material, feedback the process engineer to use the temporary solution, and feedback IQC to communicate with the supplier to replace the material and make up for the loss.

14. The patch plan is wrong, it should be released in a certain location, but it should be released in location B or BOM update.

Improvement method: When writing the program, the programmer is asked to check the bill of materials and drawings, generate the measured value of the carton, and paste the first function.

15. The ECN is not executed correctly, and the information cannot be transmitted correctly.

Improvement method: ECN is reviewed and confirmed by production, engineering and quality departments.

16. The use of alternative materials is incorrect.

Improvement method: A detailed list of alternative relations or alternative material relations should be listed in the bill of materials. Alternative materials should be used separately and supervised by the quality department.

17. Bulk materials are not used on time, resulting in the accumulation of bulk materials, and it is impossible to distinguish customers, products, work orders, etc.

Improvement method: This document requires that all "daily closed" bulk materials have release material records, bulk material use records and IPQC confirmation.

18. Lost plastic sheet.

Improvement method: Valuable materials are not included in the plastic sheet patch, and other materials are used as bulk materials, except for the resistance part.

19. Problems with other comprehensive equipment categories, such as: damaged air valves, worn seals, and slide rail cables.

Improvement method: Develop equipment maintenance specification documents and maintain equipment regularly as required.

20. The 5S workshop is not good, the dustproof facilities are poor, the dust is too much, the machine is easy to get dirty, and the site environment is not good.

Solution: Develop 5S standards, do 5S work every day, someone performs it, and someone checks it. It is strictly forbidden to use air guns to blow electrical devices and materials, and increase the dust removal capacity of the carpet. Workshop door.

21. The ESD anti-static protection measures of the SMT factory are not good, causing the IC chip to undergo electrostatic decomposition.

Improvement method: All equipment must be well grounded and checked and tested regularly.

22. The temperature and humidity are not well controlled, and the implementation is not in place, causing the material to be damp.

Improvement method: Develop humidity control element control specification documents, make humidity sensor control cards, and supervise the implementation.

In the process of SMT patch processing, SMT material management and production process control can effectively reduce material losses and control material costs. This also means that in terms of cost control, it will invisibly create revenue for the company.