PCBA Tech - SMT accelerates electronic assembly and red glue process

SMT accelerates the efficiency of electronic assembly

In today's society, the electronics manufacturing industry is developing very rapidly, and the SMT patch processing technology has also improved a lot. In this case, why is the patch operation an inevitable part of the company's manufacturing plant? How can SMT chip processing chip technology accelerate the efficiency of electronic assembly? This article will answer for you.

In today's society, the electronics manufacturing industry is developing very rapidly, and the smt patch processing patch technology has also improved a lot. In this case, why is the patch operation an inevitable part of the company's production plant manufacturing? How can SMT chip processing chip technology accelerate the efficiency of electronic assembly? This article will answer for you.

1. Micro chip processing technology

Micro-nano chip processing, micro-chip processing, and some precision processing technologies used in electronic manufacturing are collectively referred to as micro-chip processing.

The micro-nano patch processing in the micro patch processing technology is basically a planar integration method. The basic idea of planar integration is to build micro-nano structures on planar substrate materials by layer-by-layer stacking. In addition, the use of photon beams, electron beams and ion beams for cutting, welding, 3D printing, etching, sputtering and other patch processing methods also belong to micro patch processing.

2. Interconnection and encapsulation technology

The interconnection between the chip and the lead-out circuit on the substrate, such as flip-chip bonding, wire bonding, through silicon via (TSV), etc., and the encapsulation technology after the chip and the substrate are interconnected. This technology is commonly referred to as Chip packaging technology. Passive component manufacturing technology. Including the manufacturing technology of passive components such as capacitors, resistors, inductors, transformers, filters, and antennas.

3. Optoelectronic packaging technology

Optoelectronic packaging is the system integration of optoelectronic devices, electronic components and functional application materials. In the optical communication system, optoelectronic packaging can be divided into chip IC-level packaging, device packaging, and mold MEMS manufacturing technology. A micro system that integrates sensors, actuators, and processing control circuits on a single silicon chip using micro-chip processing technology.

4. Electronic assembly technology

Electronic assembly technology is commonly referred to as board-level packaging technology. Electronic assembly technology is mainly surface assembly and through-hole insertion technology. Electronic materials technology. Electronic materials refer to materials used in electronic technology and microelectronics technology, including dielectric materials, semiconductor devices, piezoelectric and ferroelectric materials, conductive metals and their alloy materials, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials and others related materials. The preparation and application technology of electronic materials is the basis of electronic manufacturing technology.

SMT patch red glue process and process description

There are two processes for SMT patch processing of red glue film. One is through the needle tube. According to the size of the component, the amount of SMT red glue varies. Manually click the SMT red glue machine to control the amount of glue time, and automatically click the SMT red glue machine. Control point SMT red glue machine passes through different glue ports and glue time; the other is printing glue, printing SMT red glue through SMT steel mesh, SMT steel mesh conforms to the standard size.

There are two processes for smt patch processing of red glue film, one is through the needle tube, according to the size of the component, the amount of SMT red glue varies, the time of manual point SMT red glue machine to control the amount of glue, automatic point SMT red glue machine Control point SMT red glue machine passes through different glue ports and glue time; the other is printing glue, printing SMT red glue through SMT steel mesh, SMT steel mesh conforms to the standard size.

PCB patch processing customization

SMT red film processing is generally aimed at power board processing, because SMT red film processing products, SMT patch components need to be greater than 0603 to be mass-produced.

At present, there is also a process called dual process in the SMT chip processing industry. It is also SMT patch red and tin paste technology. Solder paste after printing, then red glue. Or open the SMT stepping stencil, and then print the red glue. This process is used when immersion tin is required, but when most smd components are produced on PCBA boards, the process is now very mature.

PCB patch processing customization

Common problems and solutions in SMT red film processing

Common problems of SMT red adhesive:

1. Lack of impetus

The reasons for insufficient thrust are: 1. Insufficient amount of glue. 2. The colloid is not 100% cured. 3. The PCB board or components are contaminated. 4. The colloid itself is brittle and has no strength.

2. Insufficient glue or leaking

Reasons and countermeasures: 1. The printing plate is not cleaned frequently, and it should be cleaned with ethanol every 8 hours. 2. There are impurities in the colloid. 3. The opening of the screen is unreasonable or the point air pressure is too small. There are bubbles in the colloid. 5. If the rubber head is clogged, it should be cleaned immediately. 6. The preheating temperature of the dispensing head is not enough, and the temperature of the dispensing head should be set to 38°C.

PCB patch processing customization

Three.lars

The so-called wire drawing means that the glue film cannot be broken during SMT dispensing, and the movement direction of the glue film to the glue head is a filament connection phenomenon. There are more circuits, and the film is covered on the printing plate, which will cause poor soldering. Especially when using a large size, the tip of the mouth is more prone to this phenomenon. The main components of SMT adhesives are the tensile properties of the resin and the setting of the coating conditions.

Solution:

1. Reduce flow

2. The lower the viscosity, the higher the degree of contact and the lower the stretching tendency, so choose as many adhesives as possible.

3. The temperature of the temperature regulator is slightly higher, and the adhesive must be adjusted to a low-viscosity, high-contact film.