PCBA Tech - Study SMT production factors and chip repair points

The production factors of SMT include optimizing materials, energy, equipment, labor, and time. The competition of SMT factories is very high, and technology determines production. When repairing smt chips, attention should be paid to reducing the thermal shock of SMA and avoiding returning

The production factors of smt include optimizing materials, energy, equipment, labor, and time. The competition of smt placement factories is very high, and technology determines production. When returning smt chips, attention should be paid to reducing the thermal shock of SMA and avoiding SMA failure caused by repair. Next, I will introduce the details for you.

1. The production factors of smt

1. The patch produced by smt patch factory has the characteristics of high reliability and high dust resistance, and has low solder joint defect rate and good high frequency performance. The patch produced by smt patch factory can not only reduce electromagnetic and radio frequency interference, but also can easily increase productivity through automated equipment. The production cost of the patch is reduced, generally speaking, it can save about 50%. This allows the manufacturers we need to produce to save materials, energy, equipment, labor, and time, so that the saved time and cost can be done more.

2. In the process of manufacturing and assembly, the challenge faced by smt placement factories is that they cannot directly measure the voltage of the solder joints. This puts us at the risk of connecting with the most commonly used metric components PCB components when we are only producing. This makes it necessary for the smt chip factory to passively transform the chip production and optimize the method, which makes us more mature in production technology and makes our SMT chip technology stand at the forefront of the world's technology.

3. Chip processing shows its importance. In fact, the production and processing of the patch in the early smt patch factory was designed to assist in the practical function of the production patch. Therefore, it is very necessary to draw the circuit board and carry out such patch processing and debugging, which is also a necessary process. Don't be careless in this step of chip processing. This is the basis for determining the quality of electrical components. If you can’t even lay a good foundation, how can our smt patch factory get a foothold in the current industrialized society? The smt patch factory is very competitive. Whether it can be produced in this market is very important. Much depends on the technology of the smt patch factory.

2. Precautions for smt chip repair

1. Hand-held portable hot air rework tool. The hand-held portable hot air rework tool is light in weight and easy to use. When using this rework tool, special hot air nozzles must be designed for different types of SMD. During operation, it is necessary to control the heated air flow to spray it to the position of the pad corresponding to the pin of the reworked device without melting the solder on the welding seam of the adjacent device. After the solder on the soldering seam melts, immediately use a silver clamp to pick up the device or use a hot air tool to push the device pin away from the pad to complete the desoldering operation. To replace the new device, you can use the plated iron to carry out the pick-and-place operation, use the ordinary soldering iron for the welding operation or use the hand-held hot air rework tool for the reflow welding operation.

2. PCB fixed component hot air rework system. The fixed component hot air rework system has general type and type. The general type is used for the rework of conventional components, and the professional type is used for the rework of invisible PCB components with BGA solder joints. The general working principle is the same as the hand-held hot air rework tool, and there are different special hot air nozzles corresponding to different SMDs.

3. However, it can semi-automatically use a hot air nozzle to heat the device pins. After the solder is melted, the removed device can be picked up by a vacuum nozzle installed in the center of the nozzle and coaxial with the nozzle. This fixed rework tool has different structural forms. One structural form is to set a hot air nozzle for preheating the SMA under the PCB to reduce the thermal shock suffered by the SMA and avoid SMA failure caused by rework.