PCBA Tech - Discuss SMT placement machine process and welding

PCB printing (red glue/solder paste) -> PCB inspection (optional AOI full passive visual inspection) -> PCB mounting (first paste the generous parts and then paste the major components: high-speed placement and integrated circuit placement Installation) -> Inspection (Optional AOI optical/visual inspection) -> Soldering (reject hot air reflow soldering for soldering) -> Inspection (Can be divided into AOI optical inspection details and fruitful test inspection) -> Training (operating equipment: Soldering station and hot-air desoldering station, etc.) --> board splitting (manual board splitting machine to cut the board)

The process flow is simplified as follows: printing-patch-welding-inspection (each process can be included in the inspection key to control quality)

1. Solder paste printing: the dip dyeing is to print the solder paste on the pads of the PCB with a scraper at a 45 degree angle to prepare for the soldering of PCB components. The configuration used is a printing machine (a solder paste printing machine), which is located at the forefront of the SMT consumer line.

2. Whole machine placement: its dip dyeing is to correctly install the appearance assembly components on the robust position of the PCB. The configuration used is a placement machine, which is located at the back of the printing press in the SMT production line. It is generally a high-speed machine and a general-purpose machine according to consumer needs.

3. Whole machine placement: its dip dyeing is to correctly install the appearance assembly components on the robust position of the PCB. The configuration used is a placement machine, which is located at the back of the printing machine in the SMT production line of Gongming SMT placement processing. It is generally a high-speed machine and a general-purpose machine according to consumer needs.

4. Reflow soldering: its dip dyeing is to ablate the solder paste, so that the appearance of the assembled components and the PCB board are welded together. The configuration used is a reflow oven, which is located at the back of the placement machine in the SMT production line. The temperature requirements are equally stringent. It is necessary to conduct a temperature measurement in time. The measured temperature is indicated by the profile.

5. AOI optical inspection: its dip dyeing is to inspect the welding quality of the welded PCB board. The operated configuration is a passive optical inspection machine (AOI), which can be placed in the center of the consumer line according to the needs of inspection. Some before reflow soldering, some after reflow soldering

6. Training and repair: the impregnation is to hold PCB boards that hinder the inspection. The equipment used is a soldering iron, a repair station, etc. Configured after AOI optical inspection

7. Sub-board: its dip dyeing divides the multi-connected PCBA, so that it can be separated into individual parts, which generally rejects the V-cut and board-lag cutting methods.

8. PCB solder paste printing: The dip dyeing is to print the solder paste on the PCB pads with a scraper at a 45 degree angle to prepare for the soldering of the components. The configuration used is a printing machine (a solder paste printing machine), which is located at the forefront of the SMT consumer line.

9. Whole machine placement: its dip dyeing is to correctly install the appearance of the assembled PCB components to the robust position of the PCB. The configuration used is a PCBA placement machine, which is located on the back of the printing machine in the consumer line. It is generally a high-speed machine and a general-purpose machine according to consumer needs.