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The efficiency of the PCB chip processing factory is one of the foundations of SMT chip processing during production. When designing and setting up the SMT production line, it is necessary to select the appropriate process materials for PCB proofing according to the process flow and process requirements. PCBA process materials include Solder, solder paste, adhesives and other solder and patch materials, as well as fluxes, cleaners, heat transfer media and other process materials.
(1) Solder and solder paste. Solder is an important structural material in the surface assembly process. In different applications, different types of solder are used to connect the smt metal surface of the object to be soldered and form solder joints. Reflow soldering is a kind of Solder paste is a kind of solder, and the viscosity of SMC/SMD is fixed in advance.
(2) Flux, flux is an important process material in surface assembly, which is one of the key factors affecting the quality of welding. It is necessary in various welding processes, and its main function is flux.
(3) Adhesives. Adhesives are the bonding materials in surface assembly. In the wave soldering process, adhesives are usually used to pre-fix the components to the PCBA. PCBA is processed. When SMD is assembled on both sides of the SMT, even if reflow is used Soldering, adhesives are also often applied to the center of the SMT land pattern to enhance the fixation of the SMD and prevent the SMD from shifting and falling during assembly.
(4) Detergents and cleaners are used for surface assembly to clean the residue left on the SMA after the soldering process. Under current technical conditions, cleaning is still an integral part of the surface mount process, and solvent cleaning is the most effective Of cleaning methods.
What are the advantages of PCBA patch processing PCBA patch.
1. High reliability, strong anti-vibration ability, PCBA patch processing adopts chip parts, high reliability, small and light parts, strong anti-vibration ability, automatic production, high bonding reliability, and the general defective solder joint rate is less than 10,000 One-fold, which is an order of magnitude lower than that of through-hole plug-in wave soldering technology, and the defect rate of solder joints of electronic products or parts is low.
Second, electronic products are small in size and high in assembly density. The volume of PCBA patch processing components is only about 1/10 of the traditional plug-in components, and the weight is only 10% of the dip plug-in components of traditional patch processing plants. Smt technology is usually used for electronic products. The volume can be reduced by 40%-60%, the mass can be reduced by 60%~80%, and the area and weight can be greatly reduced. The smt chip processing component grid has developed from 1.27mm to the current 0.63mm grid, and individual 0.5mm grids. The use of hole mounting technology to install components can increase the assembly density.
Third, the high-frequency characteristics are good, and the performance is reliable. Due to the solid installation of the chip components, the components are usually leadless or short-leaded, which reduces the influence of parasitic inductance and parasitic capacitance resistance, and improves the high-frequency characteristics of the PCB circuit board circuit. Reduce electromagnetic and radio frequency interference. The higher frequency of circuits designed by smc and smd can reach 3ghz, and the chip components are only 500mhz, which can shorten the transmission delay time. It can be used for circuits with clock frequencies higher than 16mhz. If mcm technology is used, it is the high-end of computer workstations. The clock frequency can be 100mhz, and the additional power consumption caused by parasitic reactance can be reduced by 2 to 3 times.
