PCBA Tech - PCBA processing process

PCBA processing process
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of you. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields.
1.PCBA processing single-sided surface assembly process: solder paste printing-patch-reflow soldering;
2. PCBA processing double-sided surface assembly process: A side printing solder paste-patch-reflow soldering-flip board-B side printing solder paste-patch-reflow soldering;

3. PCBA processing single-sided mixed assembly (SMD and THC are on the same side): solder paste printing-patch-reflow soldering-manual plug-in (THC)-wave soldering;
4. Single-sided mixed assembly (SMD and THC are respectively on both sides of the PCB): B-side printing red glue-patch-red glue curing-flap-A side plug-in-B side wave soldering;

5. Double-sided mixing device (THC is on side A, and both sides A and B have SMD): A side printing solder paste-patch-reflow soldering-flipping board-B side printing red glue-patch-red glue curing-turning Board-A side plug-in-B side wave soldering;

6. Double-sided mixed packaging (SMD and THC on both sides of A and B): Printed solder paste on side A-patch-reflow soldering-flipping board-printing red glue on side B-patch-red glue curing-flipping board-A Surface plug-in-B-side wave soldering-B-side plug-in is attached.

In the soldering process, the variables with the smallest variables should belong to the machinery and equipment, so they are the first to be checked. In order to achieve the correctness of the inspection, an independent electronic instrument can be used to assist, such as using a thermometer to detect various temperatures and using an electric meter to accurately calibrate machine parameters. .
Find out the most suitable operating conditions from actual operations and records. iPCB has passed ISO9001:2008, ISO14001, UL, CQC and other quality management system certifications, and produces standardized and qualified PCB products. We master complex process skills and use professional equipment such as AOI and Flying Probe to control production, X-ray inspection machines, etc. . Finally, we will use double FQC inspection of appearance to ensure shipment under IPC II standard or IPC III standard.