PCBA Tech - Precautions for PCBA proofing and SMT proofing content

1. What are the precautions in the PCBA proofing process?

Speaking of PCBA, I believe that many people still feel a little unfamiliar, because the field of its application is still relatively professional. Therefore, in many cases, if we have related needs, we still need to take the initiative to learn some related information.

1. First of all, we need to carefully check some documents and materials of PCBA proofing to avoid some material problems in advance. Then make a cautious choice on the number of proofing, so that you can effectively control the cost and better improve the efficiency of proofing.

2. Secondly, a comprehensive process approval is also essential, because it can make the process configuration more reasonable. In addition, we need to confirm the device package, because this can effectively avoid the failure of proofing due to package errors.

3. Finally, it is necessary to control the production quantity, reduce costs and ensure quality.

Carry out a comprehensive electrical inspection to improve the electrical performance of the product. In addition, it is also essential to communicate precautions with proofing customers and prevent accidents in advance, because safety is the most important at all times.

2. What are the work contents of SMT quick proofing?

SMT refers to surface mount technology. The assembly of traditional electronic parts is mostly in the mode of pin insertion into the circuit board. This kind of parts is firmly combined, but the circuit board must be made with through holes suitable for the insertion of the parts. Therefore, the density of the parts is low and the circuit needs to be made. The hole diameter of the board parts is also larger. The following briefly introduces the related content of SMT quick proofing.

First of all, before the soldering process of SMT quick proofing, it is necessary to understand whether the components have special requirements, such as soldering temperature conditions, assembly methods, etc. Some components cannot be immersed in tin, but can only be soldered with an electric soldering iron, such as chip potentiometers and aluminum electrolytic capacitors, so you need to choose the correct soldering method according to the situation. For components that need immersion tin soldering, it is best to dip them only once. Repeated tin immersion will cause the printed board to bend and the components to crack.

Secondly, in the welding process, in order to prevent electrostatic damage to the components, the electric soldering iron and soldering furnace used should have a good grounding device. For the selection of printed boards, the thermal deformation should be small, and the copper foil should be coated with a large force. Due to the narrow traces of the copper foil for surface assembly and the small pads, if the anti-stripping ability is insufficient, the pads are easy to peel off. Generally, epoxy glass fiber substrates are used. If the PCB board needs to be repaired, the number of disassembly and assembly of components should be reduced as much as possible, because multiple disassembly and assembly will lead to the complete scrap of the printed board. In addition, for mixed printed boards, if interposing components hinder the disassembly and assembly of chip components, they can be removed first.

The above is the introduction about SMT quick proofing related content