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Soldering is one of the most important parts of PCBA board manufacturers in the assembly process of electronic products. If there is no corresponding welding process quality assurance, any well-designed electronic equipment will be difficult to achieve the design goals. Therefore, during the welding process, the following operations must be performed:
1. Even if the weldability is good, the welding surface must be kept clean.
Due to long-term storage and contamination, harmful oxide film, oil stains, etc. may be produced on the surface of the soldering pad. Therefore, the surface must be cleaned before welding, otherwise it is difficult to guarantee the quality.
2. The temperature and time of PCBA soldering should be appropriate.
When the soldering is uniform, the solder and the solder metal are heated to the soldering temperature, so that the molten solder soaks and diffuses on the surface of the solder metal and forms a metal compound. Therefore, in order to ensure that the solder joints are firm, it is necessary to have an appropriate soldering temperature. At a sufficiently high temperature, the solder can be wetted and diffused to form an alloy layer. The temperature is too high for welding. The soldering time has a great influence on the solder, the wettability of the soldered components and the formation of the bonding layer. Correctly controlling the welding time is the key to high-quality welding.
3. The solder joints must have sufficient mechanical strength.
In order to ensure that the welded parts will not fall off and become loose under vibration or impact, the welded joints must have sufficient mechanical strength. In order to make the solder joints have sufficient mechanical strength, generally the method of bending and soldering the lead terminals of the component can be used, but too much solder cannot be accumulated, which is easy to cause a short circuit between a virtual solder and a short circuit. Solder joints and solder joints.
Fourth, the welding must be reliable and ensure conductivity.
In order to make the solder joints have good electrical conductivity, it is necessary to prevent false soldering. Virtual soldering refers to the fact that there is no alloy structure between the solder and the solder surface, but simply attaches to the surface of the solder metal. In welding, if only a part of the alloy is formed and the remaining part is not formed, the solder joint can also pass current in a short time, and it is difficult to find the problem of the instrument. However, as time goes by, the surface that does not form an alloy will be oxidized, which will cause time to open and break, which will inevitably cause product quality problems.
In short, high-quality solder joints should be: solder joints are bright and smooth; the solder layer is uniform and thin, suitable for the size of the pad, and the outline of the joint is fuzzy; the solder is enough and spread into the shape of the skirt; there are no cracks, pinholes, There is no flux residue.
PCB factory have focused on electronic product design and development, component placement and programming testing for more than ten years. The main R&D and production products include: handheld printers, power banks, industrial control development boards, medical equipment and other products, and provide various electronic products It features one-stop SMT patch, THT plug-in, three anti-paint technology and finished product assembly processing to provide the best quality products and services for your electronic product needs.
