PCBA Tech - White spot analysis in PCBA patch processing

White spot analysis in PCBA patch processing
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
In the production process of PCBA patch processing, some processing defects occasionally occur. One of them is the white spot or day shift on the PCBA. For PCBA quality inspection, this problem needs to be solved. What is the reason for this phenomenon? How to solve?

reason:

1 The circuit board is subjected to improper thermal stress;

2 Due to the influence of improper mechanical force, local resin and glass fiber are separated, forming white spots;

three. Some PCBA processing equipment is infiltrated by fluorine-containing chemicals and etched glass fiber cloth, forming regular white spots.

solution:

1 Strictly control the parameters of processing links such as hot air rectification and infrared heat melting;

2 In order to reduce the external force of the machine, measures should be taken to reduce or reduce the excessive vibration of the machine when processing the PCBA patch.

three. In the case of tin-lead alloy electroplating, this kind of poor processing phenomenon is easy to appear between the gold-plated plug and the plug, so attention should be paid to selecting the appropriate tin-lead and controlling the operation process.
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