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What are the selection criteria for PCBA board processing components and substrates?
PCBA processing includes processes such as circuit board production, PCB proofing, smt patch processing, and component procurement. So, what are the selection criteria for PCBA board processing components and substrates?
1. Selection of components
The selection of components should fully consider the needs of the actual area of the SMB, and use conventional components as much as possible. Do not blindly pursue small-size components to avoid increasing costs. IC devices should pay attention to the pin shape and pin spacing; the QFP with a pin spacing of less than 0.5mm should be carefully considered, it is better to directly use BGA packaged devices. In addition, the packaging form of components, PCB solderability, reliability of smt mounting, and temperature tolerance should all be considered.
After selecting the components, a component database must be established, including relevant information such as installation dimensions, pin dimensions, and SMT manufacturers.
Second, the choice of base material
The substrate should be selected according to the use conditions and mechanical and electrical performance requirements of the SMB. Determine the number of copper-clad surfaces of the substrate according to the SMB structure (single-sided, double-sided or multi-layer); determine the thickness of the substrate according to the SMB size and the quality of the components carried per unit area. When selecting SMB substrates, factors such as electrical performance requirements, Tg value (glass transition temperature), CTE, flatness, etc. should be considered, as well as factors such as price.
The above is my simple review of the selection criteria of PCBA board processing components and substrates. I hope my sharing can be helpful to you!
