PCBA Tech - Process essentials of SMT patch processing

The process essentials of SMT patch processing, as the name suggests, refers to the key points of smt patch process technology or process methods and requirements. Mastering these key points is equivalent to grasping the "soul" of process technology. When encountering ever-changing bad soldering phenomena, PCB manufacturers can analyze and solve them in the right direction.

For example, if you don't understand the two microscopic physical processes of "twice collapse" and "deformation" during the BGA soldering of PCB circuit boards, it is difficult to understand the meaning of BGA soldering peak temperature and soldering time. For another example, if you do not understand that lead solder paste soldering and lead-free BGA will change the melting point of the solder joints and the characteristics of the components, it is difficult to understand the complexity of the mixing process. Therefore, when learning process knowledge, it is very important to master the essentials of PCB manufacturing. It is the basis for analyzing and solving difficult SMT process problems.

Surface mount soldering technology (SMT) is a relatively complex and constantly evolving soldering technology. From the previous leaded process to lead-free process, from large pad soldering to micro-pad soldering, PCB manufacturing challenges continue, but its basic principle has not changed. Master the process essentials of PCB manufacturing, engineering knowledge, the generation mechanism of common bad welding phenomena, and treatment countermeasures, so that the SMT patch technology is more mature and stable, and an effective quality control system is established. It is of great practical significance to quickly solve the problem of smt processing and production technology.