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Someone once compared IC carrier board to "the crown of PCB".
IC carrier board, also called packaging substrate, is an important material used to connect chips and PCB boards in chip packaging. It accounts for 40-50% of the material cost in low-end packaging and 70-80% in high-end packaging and is the main material with the largest value in packaging.
In short, high-end products are of great quality. But ordinary PCB enterprises, can only look from afar and dare not blaspheme. After all, to take off the crown, they must first overcome three difficulties:
Capital
As a capital-intensive industry, the complex production process of IC carrier PCB requires a large amount of investment in imported equipment. At the same time, when downstream customers certify the carrier plate factory, the capacity is also one of the assessment requirements. New entrants need to invest a large amount of money at one time, and it is difficult to see a return in the short term.
technical obstacle
IC carrier boards are connected with chips. Compared with ordinary PCB products, the products are smaller in size and higher in precision. They have very high requirements in terms of fine lines, hole spacing and signal interference. Therefore, highly precise inter-layer alignment technology, electroplating capability and drilling technology are required. Consumer electronics put forward a demand for thin and light IC carrier plates, and server products put forward a demand for high-density interconnection of IC carrier PCB. The production of IC carrier plates integrates materials, chemistry, machinery, optics and other fields of technology. In addition to configuring advanced equipment, it also requires the continuous accumulation of production processes and technologies, which forms a high technical barrier for new enterprises.
The downstream of IC carrier PCB are mostly large customers, who have high requirements for quality, scale, efficiency and supply chain security. For the procurement of core components such as carrier plates, the "qualified supplier certification system" is generally adopted, and the supplier's operation network, management system, industry experience and brand reputation have high requirements. Certification needs to go through production system certification, product certification, small order trial, and small batch order Long cycle processes such as large quantities of orders, such as Samsung's storage carrier plate certification cycle of up to 24 months. After the certification is passed, the downstream customers will maintain a long-term cooperative relationship with the carrier plate factory, lacking the motivation to change suppliers, and forming a significant barrier to entry for new enterprises lacking a customer base.
The IC carrier PCB board market is in full swing, and the upstream manufacturers supporting it are also actively preparing for the war, striving to work hand in hand with the top PCB manufacturers. IPCB has devoted itself to PCB electroplating for many years, and has performed exceptionally well in the uniformity of electroplating. It is reported that it has successfully launched an electroplating product line specifically for IC carrier PCB, and has been applied in several first-line circuit board manufacturers, which is highly recognized by customers. Shengyi Technology (600183. SH) is a global leader in CCL. The company's layout in the field of packaging materials is mainly in the carrier substrate and adhesive film. It has been applied in large quantities in WB packaging substrate products, mainly in the fields of sensors, cards, RF, cameras, fingerprint identification, storage and other products. At the same time, it has been developed and applied in more high-end AP, CPU, GPU and AI products represented by FC-CSP and FC-BGA packages. Base material of carrier plate: the company will start layout before 2010. The Songshan packaging project started in 2020 is expected to be put into production in Q3 2022, with a monthly capacity of 200000 sheets. Laminated adhesive film: the company started the adhesive film project from 2018, and gradually promoted various products, from physical property design to carrier plate process reliability verification to product performance verification. At present, many products are produced in small batches. The main business of Huazheng New Material (603186. SH) is copper-clad laminate. At present, the company's layout in the field of IC carrier materials mainly includes BT/BT substrate resin materials and CBF laminated insulating film. Class BT/BT resin has been mass-produced and shipped. It has the characteristics of high Tg (255~330 ° C), heat resistance (160~230 ° C), moisture resistance, low dielectric constant (Dk) and low loss (Df). It is used in Chip LED, Mini backlight display, COB white light device, MiniRGB device, memory packaging, etc. On July 20, the company announced the establishment of a joint venture with Shenzhen Advanced Electronic Materials International Innovation Research Institute (the company invested 52 million yuan) to carry out the research, development and sales of CBF laminated insulation film. It is a key packaging material that can be applied to important application scenarios in advanced packaging fields, such as FC-BGA high-density packaging substrate, chip rewiring dielectric layer, chip plastic packaging, chip bonding, chip bump bottom filling, etc.
