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PCB News - What are the advantages of HDI boards

PCB News

PCB News - What are the advantages of HDI boards

What are the advantages of HDI boards

2021-08-22
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Author:Aure

What are the advantages of HDI boards

The HDI board has an inner layer circuit and an outer layer circuit, and then processes such as drilling and metallization are used in the holes to realize the internal connections of the various layers of the circuit. Usually, deposits are used for manufacturing. The longer the establishment time, the higher the technical level. Ordinary HDI boards are basically disposable. High-end HDI uses two or more stacking technologies, while using advanced HDI board/PCB technology, such as stacking holes, plating and filling holes, and laser direct drilling.

What are the advantages of HDI boards

HDI board has the following advantages:

  1. Improve design efficiency;

2. Can improve thermal performance;
3. Promote the use of advanced construction technology;
4. Better reliability;
5. Has better electrical performance and signal accuracy;
6. Increase circuit density, interconnection of traditional circuit boards and parts;
7. It can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD);
8. Can reduce PCB cost. When the PCB density increases to more than eight layers, it is manufactured by HDI, and its cost will be lower than the traditional complex pressing process.


HDI boards are widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are usually manufactured using a stacking method. The longer the build time, the higher the technical level of the circuit board. Ordinary HDI boards are basically disposable. High-end HDI uses two or more build techniques. At the same time, advanced PCB technology is used, such as stacked holes, plated hole filling and laser direct drilling. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.