PCB News - How to make flexible and hard board production

How to make flexible and hard board production

The birth and development of FPC and PCB gave birth to a new product of soft and hard board. Therefore, the rigid-flex board is the flexible circuit board and the rigid circuit board, which are combined according to the relevant process requirements after pressing and other processes to form a circuit board with FPC characteristics and PCB characteristics.
After the FPC soft board is produced, it must go through those processes to complete the production of the soft-hard board.
1. Punching
Drill holes on the FR4 circuit board and PP film, and the design on the alignment hole is not the same as the general through hole. After the punching is completed, browning is required.
2. Riveting
Laminate the Copper clad laminate, PP glue, and FPC circuit board and place them neatly. The original old process is to laminate and produce the laminate step by step, but it is a waste of time. After many attempts, it was found that the stacking process can be completed once.
3. Laminate
This is a relatively complete step in the production of rigid-flex board. Most of the materials are integrated for the first time. First, the bottom layer of copper clad laminate and PP film, above are the FPC soft board produced in the previous process, and a layer is placed on the FPC soft board. PP film, then place the last layer of copper clad laminate. All materials to be laminated are placed in order and pressed together.
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4. Gong Banbian (also known as trimming)
That is to remove the part of the PCB circuit board where there is no circuit at the edge of the circuit board and the part that is not going to be made in the future. Afterwards, it is necessary to measure whether the material has excessive expansion and contraction. Because the PI used in the production of flexible boards in time is also expansion and contraction, this has a very large impact on the production of circuit boards.
5. Drilling
This step is the first step of one step of conducting the entire PCB circuit board, and the production parameters should be produced according to the design parameters.
6. Desmear, plasma treatment
First, remove the scum produced by the drilling of the PCB circuit board, and then use plasma cleaning to clean the through holes and the board surface.
7. Immersion copper
This step is the process of electroplating through holes, also known as hole metallization. Realize through-hole power conduction.
8. PCB circuit board surface plating
Partially electroplating copper on the upper surface of the electroplating hole makes the copper thickness above the through hole exceed a certain height of the copper clad board surface.
9. Outer dry film positive film production
The same as the process of making anti-corrosion dry film of FPC soft board, make the circuit to be etched on the copper clad board. After the development is completed, check the circuit.
10. Graphic plating
After the initial copper sinking, pattern electroplating is performed, and the current time and copper plating wire are used according to the design requirements to reach a certain electroplating area.
11. Alkaline etching
12. Print solder mask
This step has the same effect as that of the soft board protective film. We see that the PCB hard board is generally green. This step is generally called green oil printing. After printing is completed, the inspection is carried out. There are also customers who require other solder mask inks, such as butter, blue oil, red oil, white oil, black oil, etc., with photosensitive and matte.
13. Open the lid with the gong
The gong opening cover is also called the cover opening, which is the area where the soft board is located, but the area not needed by the hard board is laser cut to expose the soft board.
14. Curing is also a baking process
15. Surface treatment: Immersion gold, spray tin, osp, Immersion silver, Immersion tin, gold plating, etc.
Generally, at this time, a rigid-flex board (FPCB) has been manufactured, and only the metallization treatment is required on the surface of the circuit board, which can play a role in preventing wear and oxidation. Generally, this process is to soak the circuit board in a chemical solution, and the metal elements in the solution are densely distributed on the circuit board circuit.
16. Printed characters/printed text
The positions of the parts to be assembled and some basic product information are printed on the rigid-flex board in the form of characters.
17. Flying probe test/test fixture test
This is an inspection process for whether the PCB circuit board is qualified. The test items are tested for electrical properties according to customer requirements. The tests generally include impedance test, open and short circuit test and so on.
18.FRQ final inspection
19. Packaging and shipping
There are many methods for circuit board packaging. Generally, most manufacturers use packaging bags to separate them, and then use a vacuum packaging machine to vacuum-pack the flexible and rigid boards.