PCB News - What is an LED die substrate?

What is an LED die substrate?
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If the PCB factory is determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and the PCB factory can get the opportunity to develop again.
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields. From this point of view, the environmental protection problems of PCB factories can be solved from the following two points.

The LED die substrate is mainly used as a medium for heat dissipation between the LED die and the system circuit board, and is combined with the LED die through the process of wire bonding, eutectic or flip chip. Based on heat dissipation considerations, the LED die substrates on the market are mainly ceramic substrates, which can be roughly divided into three types: thick-film ceramic substrates, low-temperature co-fired multilayer ceramics, and thin-film ceramic substrates. For high-power LED components, thick-film or low-temperature co-fired ceramic substrates are mostly used as die heat dissipation substrates, and then the LED die and the ceramic substrate are combined with gold wires.

As mentioned in the introduction, this gold wire connection limits the effectiveness of heat dissipation along the electrode contacts. Therefore, major domestic and foreign manufacturers are all working hard to solve this problem. There are two solutions. One is to find a substrate material with high heat dissipation coefficient to replace alumina, including silicon substrates, silicon carbide substrates, anodized aluminum substrates or aluminum nitride substrates. Among them, silicon and silicon carbide substrates are semiconductor materials. Due to its characteristics, it has encountered more severe tests at this stage, and the anodized aluminum substrate is likely to be conductive due to the insufficient strength of the anodized oxide layer, which makes its practical application limited. Therefore, at this stage The more mature and generally accepted one is to use aluminum nitride as the heat dissipation substrate; however, the current limitation is that the aluminum nitride substrate is not suitable for the traditional thick film process (the material must be heat-treated in the atmosphere at 850°C after the silver paste is printed. It has material reliability issues), therefore, aluminum nitride substrate circuits need to be prepared by thin film manufacturing processes. The aluminum nitride substrate prepared by the thin-film process greatly accelerates the efficiency of heat from the LED die through the substrate material to the system circuit board, thus greatly reducing the burden of heat from the LED die to the system circuit board through the metal wire, thereby achieving high heat dissipation Effect. Our factory is located in China. For decades, Shenzhen has been known as the world's electronics R&D and manufacturing center. Our factory and website are approved by the Chinese government, so you can skip the middlemen and buy products on our website with confidence. Because we are a direct factory, this is the reason why 100% of our old customers continue to purchase on iPCB.