PCB News - Printed Circuit Board Plating Process Technology and Explain

Printed Circuit Board Plating Process Technology and Explain

At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If the PCB Manufacturer is determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and the PCB factory can get the opportunity to develop again.
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields. From3 oz copper double-sided circuit board.

(1) Pickling
1. Function and purpose: to remove oxides on the board surface and activate the board surface. The general concentration is 5%, and some are maintained at about 10%, mainly to prevent the instability of the sulfuric acid content of the bath liquid due to the introduction of moisture;

(2) Full board copper electroplating: also called once copper, panel electricity, Panel-plating

1. Function and purpose: protect the thin chemical copper that has just been deposited, prevent the chemical copper from being etched away by acid after oxidation, and add it to a certain extent by electroplating

(3) Acid degreasing

1. Purpose and function: remove the oxide on the copper surface of the circuit, the remaining glue of the ink residual film, and ensure the bonding force between the primary copper and the patterned copper or nickel

(Four), micro-eclipse:

1. Purpose and function: clean the copper surface of the roughened circuit to ensure the bonding force between the patterned copper plating and the primary copper

(5) Pickling

1. Function and purpose: to remove oxides on the board surface and activate the board surface. The general concentration is 5%, and some are maintained at about 10%, mainly to prevent the instability of the sulfuric acid content of the bath liquid due to the introduction of moisture;

(6) Graphic copper plating: also known as secondary copper, copper plating on lines

1. Purpose and function: In order to meet the rated current load of each line, each line and hole copper needs to reach a certain thickness, and the purpose of line copper plating is to thicken the hole copper and line copper to a certain thickness in time;

(7) Tin plating

1. Purpose and function: The purpose of pure tin electroplating is to use pure tin purely as a metal anti-corrosion layer to protect the circuit from etching;

(Eight), nickel plating
1. Purpose and function: The nickel-plated layer is mainly used as a barrier layer between the copper layer and the gold layer to prevent the mutual diffusion of gold and copper, which affects the solderability and service life of the board; at the same time, the bottoming of the nickel layer also greatly increases the gold layer Mechanical strength; our factory is located in China. For decades, Shenzhen has been known as the world's electronics R&D and manufacturing center. Our factory and website are approved by the Chinese government, so you can skip the middlemen and buy products on our website with confidence. Because we are a direct factory, this is the reason why 100% of our old customers continue to purchase on iPCB.