PCB News - What are the electronic components on the circuit board?

What are the electronic components on the circuit board?
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People often deal with electrical appliances, but many people don’t know the names of the electronic components on the circuit boards. The editor below has compiled pictures of several commonly used power supply motherboards, and marked the names of the electronic components for your reference. Don't spit on me if you have an engineer level. Ha ha
Electronic components have different packaging types. Different types of components have the same shape, but the internal structure and use are very different. For example, the components of the TO220 package may be triodes, thyristors, field effect transistors, or dual diodes. TO-3 packaged components include transistors, integrated circuits, etc. There are also several types of packages for diodes, glass package, plastic package and bolt package. Diode types include Zener diodes, Rectifier diodes, Tunnel diodes, Fast recovery diodes, Microwave diodes, Schottky diodes, etc. All of these diodes use one or more types. Package. SMD components are usually small and some are not printed at all. Most of the commonly used sizes are several, so it is difficult for inexperienced people to distinguish, but SMD diodes and polarized SMD capacitors are easy to distinguish from other SMDs. Sexual patch components have a common feature, which is the polarity mark.

For component recognition, it can be distinguished by the type of printing. For components without characters on the component, the circuit principle can also be analyzed or the component parameters can be measured with a multimeter to judge. Judging component types cannot be learned overnight, it requires years of accumulated experience to understand. The editor of Electronics specially organizes some pictures of electronic component logos for everyone to see, so that everyone can understand surface mount technology (SMT, surface mount technology), which is a kind of electronic assembly technology, which originated in the 80s of the 20th century. In the ages, electronic components, such as resistors, capacitors, transistors, integrated circuits, etc., were mounted on PCBs and soldered to form electrical connections. The biggest difference from the plug-in package is that the surface mount technology does not need to reserve corresponding through holes for the pins of the component, and the component size of the surface mount technology will be much smaller than that of the plug-in package.
The patch process is composed of:
Printing (red glue/solder paste) --> inspection (optional AOI automatic or visual inspection) --> placement (first paste small devices and then paste large devices: high-speed placement and integrated circuit placement) - >Inspection (optional AOI optical/visual inspection)-->Welding (using hot air reflow soldering for soldering)-->Inspection (can be divided into AOI optical inspection appearance and functional test inspection)--> Maintenance (tool: welding Table and hot-air desoldering station, etc.)--> board splitting (cutting the board manually or by a splitting machine)
The process flow is simplified as: printing-------patch-------welding-------overhaul (testing links can be added to each process to control quality)