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In many CAD systems, the wiring is determined based on the network system. The grid is too dense and the path has increased, but the step is too small, and the amount of data in the field is too large. This will inevitably have higher requirements for the storage space of the device, and also the computing speed of the computer-based electronic products. Great influence. Some paths are invalid, such as those occupied by the pads of the component legs or by mounting holes and fixed holes. Too sparse grids and too few channels have a great impact on the distribution rate. Therefore, there must be a well-spaced and reasonable grid system to support the wiring.
The distance between the legs of standard components is 0.1 inches (2.54 mm), so the basis of the grid system is generally set to 0.1 inches (2.54 mm) or an integral multiple of less than 0.1 inches, such as: 0.05 inches, 0.025 inches, 0.02 Inches etc.
6 Design Rule Check (DRC)
After the wiring design is completed, it is necessary to carefully check whether the wiring design meets the rules set by the designer, and at the same time, it is also necessary to confirm whether the rules set meet the requirements of the printed board production process. The general inspection has the following aspects:
Whether the distance between the line and the line, the line and the component pad, the line and the through hole, the component pad and the through hole, the through hole and the through hole is reasonable, and whether it meets the production requirements.
Is the width of the power line and the ground line appropriate, and is there a tight coupling between the power line and the ground line (low wave impedance)? Is there any place in the PCB board where the ground wire can be widened?
Whether the best measures have been taken for the key signal lines, such as the shortest length, the protection line is added, and the input line and output line are clearly separated.
Is there a separate ground wire for the analog circuit and digital circuit part?
Whether the graphics (such as icons, annotations) added to the PCB will cause signal short circuit.
Modify some undesirable linear shapes.
Is there a process line on the PCB? Whether the solder mask meets the requirements of the production process, whether the solder mask size is appropriate, and whether the character logo is pressed on the device pad, so as not to affect the quality of the electrical equipment.
Whether the outer frame edge of the power ground layer in the multilayer board is reduced. For example, the copper foil of the power ground layer is exposed to the outside of the board and it is easy to cause a short circuit.
The above is an introduction to the role of the network system in wiring. Ipcb is also provided to PCB manufacturers and PCB manufacturing technology.
