PCB News - PCB design highlights technical bottlenecks

PCB design highlights technical bottlenecks, and the three contradictions are difficult to reconcile?

Flomerics, a virtual prototype provider, found in a survey of 91 design engineers a few days ago that most of the interviewees said that "the thermal design of the circuit board. Electromagnetic compatibility (EMC) and signal integrity (SI) design requirements are often Contradictory.” According to the Flomerics survey, 59% of respondents agreed with the view that “thermal and EMC requirements in circuit board design are usually contradictory”, while only 23% disagreed. 60% of people agree that "heat and signal integrity requirements are contradictory," while 23% oppose it. However, the Flomerics survey gave a positive description of the communication and collaboration between the company's electronic and mechanical design engineers. 64% of respondents described communication as "good" or "very good"; 31% of respondents said "needs improvement"; only 4% described it as "very bad". 56% of the respondents believe that "a better interface between electronic and mechanical software will greatly improve the collaboration between electronic design engineers and mechanical design engineers", while 28% of respondents said "software is not a problem? Good Management. Interpersonal communication and other factors are more important." Flomerics also asked respondents to determine the “proportion of overtime and over-budget completion of new designs and the most common reasons for this phenomenon.” Among them, 50% of the interviewees said that 10% to 30% of new designs would over-time and over-budget; And 28% of the respondents said that this ratio is only 10%; 18% of the people said that this ratio is 30% to 50%. According to Flomerics' introduction, only 4% of respondents believed that this ratio was more than 50%. Flomerics said that the most common reasons for overtime and over budget include: design requirements changes (59%); circuit design (39%); thermal issues (34%); EMC issues (32%); signal integrity issues (30%); Physical layout problems (22%); and wiring problems (19%). Respondents are allowed to choose multiple reasons. Flomerics revealed that the “average design cycle for a new circuit board design from concept to final test and manufacturing check-out” was 6 to 12 weeks. Flomerics revealed that 29% said that the average design cycle was more than 12 weeks, while 21 % Of people said it was less than 6 weeks. When asked the question "What is the biggest pressure on circuit board design engineering?" 54% of respondents think it is "function and performance", 30% say it is "time to market", and 14% Respondents thought it was "cost," Flomerics said. When asked about the design process, 62% of the respondents said that there were “many interactions” between “conceptual design, detailed design, design verification, etc.” during the design phase, while 38% said “the sequence of the design process Implementation, the "interaction is very portable" between the various stages. 61% of the interviewees said that there is "a person or a special group that is specifically responsible for the thermal design of the circuit board", while 39% said that "there is no such person or group." The results of the survey came from 91 respondents who submitted the questionnaire. The industries representing the respondents include: telecommunications (23%), power electronics (18%), aerospace and defense electronics (17%), and automotive and transportation electronics (11%).

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