PCB News - Design performance requirements for multiple substrates

The design performance of multi-substrates is mostly similar to that of single-substrate or dual-substrate, that is, to avoid filling too many circuits with too small space, resulting in unrealistic tolerances, high inner layer capacity, and even possible endangering product quality Security. Therefore, the performance specification should consider the complete evaluation of the thermal shock, insulation resistance, welding resistance, etc. of the inner circuit. The following content describes the important factors that should be considered in the multi-substrate design.

1. Mechanical design factors
The mechanical design includes selecting the appropriate board size, board thickness, board stacking, inner copper tube, aspect ratio and so on.

1 Board size
The board size should be optimized according to the application requirements, the size of the system box, the limitations of the circuit board manufacturer and the manufacturing capacity. Large circuit boards have many advantages, such as fewer substrates, shorter circuit paths between many components, so that they can have a higher operating speed, and each board can have more input and output connections, so in Large circuit boards should be the first choice in many applications. For example, in personal computers, you see larger motherboards. However, it is more difficult to design the signal line layout on a large board, requiring more signal layers or internal wiring or space, and the difficulty of heat treatment is also greater. Therefore, the designer must consider various factors, such as the size of the standard board, the size of the manufacturing equipment, and the limitations of the manufacturing process. Some guidelines for selecting standard printed circuit/board sizes are given in 1PC-D-322.

2 Board thickness
The thickness of the multi-substrate is determined by many factors, such as the number of signal layers, the number and thickness of power boards, the aspect ratio of the aperture and thickness required for high-quality punching and plating, the length of the component pins required for automatic insertion, and The type of connection used. The thickness of the entire circuit board consists of the conductive layer on both sides of the board, the copper layer, the thickness of the substrate and the thickness of the prepreg material. It is difficult to obtain tight tolerances on synthetic multi-substrates, and a tolerance standard of about 10% is considered reasonable.

3 stack of plates
In order to minimize the possibility of board distortion and obtain a flat finished board, the layering of multiple substrates should be symmetrical. That is to have an even number of copper layers, and to ensure that the thickness of the copper and the copper foil pattern density of the board layer are symmetrical. Generally, the radial direction of the construction material (for example, fiberglass cloth) used for the laminate should be parallel to the side of the laminate. Because the laminate shrinks in the radial direction after bonding, this will distort the layout of the circuit board, showing variability and low dimensional stability.

However, by improving the design, the warpage and distortion of the multi-substrate can be minimized. Through the even distribution of copper foil on the entire level and ensuring the symmetry of the multi-substrate structure, that is, ensuring the same distribution and thickness of the prepreg material, the purpose of reducing warpage and distortion can be achieved. The copper and laminated layers should be made from the center layer of the multi-substrate to the two outermost layers. The minimum distance (dielectric thickness) specified between two copper layers is 0.080 mm.

It is known from experience that the minimum distance between two copper layers, that is, the minimum thickness of the prepreg material after bonding, must be at least twice the thickness of the embedded copper layer. In other words, if the thickness of each of the two adjacent copper layers is 30μm, the thickness of the prepreg material is at least 2 (2 x 30μm) = 120μm. This can be achieved by using two layers of prepreg material (glass fiber woven The typical value of cloth is 1080).

4 inner copper foil
The most commonly used copper foil is 1oz (1oz of copper foil per square foot of surface area). However, for dense boards, the thickness is extremely important, and strict impedance control is required. This kind of board needs to be used
0.50z copper foil. For the power plane and ground plane, it is best to choose a copper foil of 2oz or heavier. However, etching heavy copper foil will reduce the controllability, and it is not easy to achieve the desired pattern of line width and pitch tolerance. Therefore, special processing techniques are required.

5 holes
According to the component pin diameter or diagonal size, the diameter of the plated through hole is usually kept between 0.028 and 0.010in, which can ensure enough volume for better welding.

6 aspect ratio
"Aspect ratio" is the ratio of the thickness of the plate to the diameter of the hole. It is generally believed that 3: 1 is the standard aspect ratio, although high aspect ratios like 5:1 are also commonly used. The aspect ratio can be determined by factors such as drilling, slag removal or etch back and electroplating. When maintaining the aspect ratio within the range that can be produced, the vias should be as small as possible.

2. Electrical design factors
Multi-substrate is a high-performance, high-speed system. For higher frequencies, the rise time of the signal is reduced, so signal reflection and line length control become critical. In a multi-substrate system, the requirements for the controllable impedance performance of electronic components are very strict, and the design must meet the above requirements. The factors that determine the impedance are the dielectric constant of the substrate and the prepreg material, the spacing of the wires on the same layer, the thickness of the interlayer dielectric and the thickness of the copper conductor. In high-speed applications, the lamination sequence of the conductors in the multi-substrate and the connection sequence of the signal net are also crucial. Dielectric constant: The dielectric constant of the substrate material is an important factor in determining impedance, propagation delay and capacitance. The dielectric constant of the glass epoxy substrate and the prepreg material can be controlled by changing the percentage of the resin content.

The dielectric constant of epoxy resin is 3.45 and the dielectric constant of glass is 6.2. By controlling the percentage of these materials, the dielectric constant of epoxy glass may reach 4.2-5.3. The thickness of the substrate is a good indicator for determining and controlling the dielectric constant.

The prepreg material with relatively low dielectric constant is suitable for use in radio frequency and microwave circuits. In radio frequency and microwave frequencies, the signal delay caused by the lower dielectric constant is lower. In the substrate, the low loss factor can minimize the electrical loss.

The above is an introduction to the design performance requirements of multi-substrates. Ipcb is also provided to PCB manufacturers and PCB manufacturing technology.