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PCB News - The development trend of SMT placement equipment

PCB News

PCB News - The development trend of SMT placement equipment

The development trend of SMT placement equipment

2021-11-04
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Author:Downs

The relevant data of the SMT industry show that the penetration rate of SMT chip processing and application in developed countries has exceeded 87%, and it has further developed to the assembly technology field represented by high-density and high-precision technology. The continuous development of SMT patch technology will inevitably put forward new requirements for technology and patch processing equipment. How to shorten the running time and continuously introduce components with a large number of pins and fine pitches has become a severe challenge faced by today's SMT devices. Choosing the appropriate SMT chip processing equipment to meet the needs of today's applications is a very difficult decision, but it is a very important choice, because the production capacity and multi-functional adaptability of electronic product assembly make the chip processing equipment The dependence of the PCB is quite large, and the PCB factory will briefly explain the development trend of equipment in the SMT chip processing industry.

1. Choose a new type of high-efficiency double-track conveying structure. In order to improve production efficiency and reduce working time faster, it is developing in the direction of high-efficiency double-track conveying structure. On the basis of retaining the performance of the traditional single-path placement machine, the dual-path conveyor placement machine designs the PCB's transportation, positioning, detection, placement, etc. into a dual-path structure.

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The working mode of this two-way structure placement machine can be divided into synchronous mode and asynchronous mode. The synchronous method is to send two PCBs of the same size to the patch processing area synchronously from a dual track for placement, and the asynchronous method is to send PCBs of different sizes to the placement area respectively. Both of these two working methods can shorten the ineffective working time of the placement machine and improve the production efficiency of the machine.

2. Choosing a high-speed, high-precision, multi-function, and intelligent placement machine. The placement speed, accuracy and placement function of the placement machine have always been contradictory. The new placement machine has been working hard to develop in the direction of high-speed, high-precision, and multi-function. Due to the continuous development of surface mount components (SMC/SMD), their packaging forms are also constantly changing. New packages, such as BGA, FC, CSP, etc., have higher and higher requirements for placement machines. For example, Samsung has introduced a dual-group dual-track placement head in the newly launched SM model, which not only improves the placement speed of integrated circuits, but also ensures good placement processing accuracy.

3. Choose multiple cantilever and multiple placement heads. In the traditional arch type placement machine, there is only one cantilever and placement head. This can no longer meet the demand for speed in modern production. For this reason, people use single cantilever placement machines. Based on the development of dual-cantilever placement machines, such as YAMAHA, SAMSUNG, etc., two placement heads alternately paste the same PCB, which doubled the production efficiency under the condition of little change in the area of the machine. In order to further improve production efficiency, people have introduced a four-cantilever machine on the basis of a double cantilever machine. The multi-cantilever machine has replaced the turret machine and has become the mainstream trend of the development of the high-speed SMT chip processing industry in the future.

4. The machine with flexible connection and modular modular structure is very popular with customers. When the product changes, it is very important to improve the adaptability of SMT chip processing equipment in time, because of the new packaging and circuit board tape. Here comes a new request. Investment in a placement equipment should often be based on current considerations and estimates of future needs. Buying a device with much more features than needed today can often avoid business opportunities that may be missed in the future. It is more economically more cost-effective to upgrade on existing equipment than to buy a new one.


5. Choose to have automatic programming ability. For very special components, new vision software tools should have the ability to automatically "learn". Users do not need to manually input parameters into the system and create device descriptions from scratch. They only need to take the device to the vision camera. The pre-photograph is enough, and the system will automatically generate a comprehensive description similar to CAD. This technology can improve the accuracy of device placement processing descriptions, reduce many operator errors, and speed up the creation of component libraries, especially when new devices are frequently introduced or uniquely shaped devices are used, thereby improving production efficiency.

The development of SMT chip processing equipment is always the most interesting area in the electronics manufacturing industry. It is the current development of electronic technology that continuously puts forward new and higher requirements for SMT chip processing equipment. In turn, electronic component chip processing equipment The new development of the company has strongly promoted the development of the electronic assembly industry, and further promoted the development of electronic technology. At present, as the SMT chip processing equipment market continues to mature, the difference from one platform to another is getting smaller and smaller. Because of this, buyers of patch processing equipment should be concerned about content beyond the manual, and the equipment evaluation should be comprehensive. It should not only look at the hardware but also the software, and consider the following key factors: machine type, imaging and flexibility. With this knowledge, you can identify the pros and cons of different devices and make wise choices.