PCB News - Shenzhen SMT patch process introduction

Shenzhen SMT patch process introduction
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields.
Basic process: template (steel mesh)---screen printing---mounting---reflow soldering---cleaning---inspection---rework---packaging

1. SMT process flow-------single-side assembly process
Incoming material inspection --> Screen printing solder paste (point patch glue) --> SMT --> Drying (curing) --> Reflow soldering --> Cleaning --> Inspection --> Rework
Two, SMT process ------ single-sided mixed process
Incoming material inspection --> PCB A-side silk screen solder paste (point patch glue) --> SMT --> Drying (curing) --> Reflow soldering --> Cleaning --> Plug-in --> Wave soldering --> Cleaning --> Inspection --> Repair

Three, SMT process ------ double-sided assembly process
A: Incoming inspection --> PCB A side silk screen solder paste (point patch glue) --> SMT --> Drying (curing) --> A side reflow soldering
--> Cleaning --> Flip board --> PCB's B-side silk screen solder paste (point patch glue) --> SMT --> Drying --> Reflow soldering (preferably only for
Side B --> Cleaning --> Inspection --> Rework) This process is suitable for mounting large SMDs such as PLCC on both sides of the PCB.
B: Incoming inspection --> PCB's A side silk screen solder paste (point patch glue) --> SMD --> drying (curing) --> A side reflow soldering
--> Cleaning --> Turnover --> PCB's B-side patch adhesive --> SMD --> Curing --> B-side wave soldering --> Cleaning --> Inspection
--> Rework) This process is suitable for reflow soldering on the A side of the PCB and wave soldering on the B side. Among the SMD assembled on the B side of the PCB, there are only SOT or SOIC
(28) This process should be used when the lead is below.
Four, SMT process ------ double-sided mixed packaging process
A: Incoming inspection --> PCB's B side patch glue --> SMD --> curing --> flip board --> PCB A side plug-in --> wave soldering
--> Cleaning --> Inspection --> Rework, paste first and then insert, suitable for the situation where there are more SMD components than separate components
B: Incoming inspection --> PCB A side plug-in (pin bend) --> Flip board -->PCB B side point patch glue --> SMD --> curing
--> Flip board --> Wave soldering --> Cleaning --> Inspection --> Rework
SMT processing technology includes many aspects, such as the design and manufacturing technology of electronic components and integrated circuits, the circuit design technology of electronic products,
Design and manufacturing technology of automatic placement equipment, development and production technology of auxiliary materials used in assembly manufacturing, anti-static technology for electronic products, etc.,
Therefore, the production of a complete, beautiful, and well-tested electronic product will be affected by many factors.
The characteristics of a complete set of surface mount equipment. Surface mount technology (SMT) is a new generation of electronic assembly technology. At present, most high-end electronic products in China are common
SMT mounting technology is used all over the world. With the development of electronic technology, surface mounting technology will be an inevitable trend in the electronics industry. Shenzhen SMT mounting technology is in the country.
It is also in the front.
The use of patch processing PCB, automatic plug-in machine AI, automatic soldering machine, etc., are machines instead of labor, which is a development trend.