PCB News - PCBA patch processing, restore the connection of gold fingers

PCBA patch processing, restore the connection of gold fingers
PCBA patch processing Sometimes, the contacts of gold fingers will be contaminated by solder. Due to improper handling, this contamination often occurs in the reflow of a device and may be contaminated by solder spraying or contact with solder paste. Solder contamination is unacceptable, because oxidation will occur quickly on the solder, which will stop a suitable electrical connection. For the matching connector, solder contamination will also transform the normally smooth joint surface into an irregularity. The surface will endanger the perfection of the connection.
The only reliable method for PCBA patch processing to alleviate this problem is to remove all solder contamination and restore the gold plating. The contaminated solder will melt within the time it is in contact with the gold, causing the gold plating to be wet. It is impossible to remove the solder without damaging the golden finger. The solder must be completely removed by mechanical and chemical methods and contact replating.
These traditional methods involve the removal and plating of chemical substances, which will increase risk to a certain extent. The proper control of traditional methods must pay attention to the protection of health and the safety of workers. The gold plating solution contains potassium cyanide hydride, the nickel plating solution contains zinc sulfate and the electrolyte contains sodium hydroxide. Each piece of equipment must strictly observe the rules for its supply, control, and configuration of these raw materials, not only with proper circulation The water must pump out the unpleasant air.
This step-by-step traditional way of repairing edge connections is well applied in IPC 7721. First, start to remove the solder dirt by yourself, clean the assembly and spread the gold-plated tape around the area. This step is to prevent electroplating and spraying of solvents to adjacent areas and parts.

Next, move the solder dirt. PCBA patch processing, the flowing solder covering any contact will contaminate the entire area, so the sprayed solution will work evenly in this area. Then remove the solder as much as possible from the capillary action of the soldering iron and copper tin, and clean the area.
Now the remaining solder can be removed by the sprayed solution. The position of the working accessories makes this area sprayed out of the plate by an amount, and the overflowing amount of the solution will burn. Once the alkaline metal is exposed, thoroughly rinse the entire area with water, and lightly use sandpaper to polish the joints and polish the few scratches. At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields. From this point of view, the environmental protection problems of PCB factories can be solved from the following two points.