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With the needs of printed circuit board design, the direct plating process has been continuously developed in the past few years. Driven by miniaturization, from leaded components to surface mount components, PCB design has evolved to adapt to miniature components with more pins, which leads to increased PCB layers, thicker circuit boards, and through holes The diameter is smaller. In order to meet the challenge of high aspect ratio, the technical specifications of the production line should involve the improvement of the solution transfer and exchange of the micropores, such as the use of ultrasonic to quickly wet the holes and remove bubbles, and improve the ability of air knives and dryers to effectively dry thick circuits Small holes on the board.
Since then, PCB designers have entered the next stage: blind hole hunger, the number of pins and ball grid density exceed the board surface available for drilling and routing. With the 1.27mm to 1.00 mm grid of the ball grid array package (BGA) shifting to the 0.80mm to 0.64 mm grid of the chip scale package (CSP), the micro-blind via has become a sharp weapon for designers to deal with the challenges of HDI technology.
In 1997, feature phones began to use 1 + N+1 design for mass production; this is a design with micro-blind holes in the superimposed layer on the core. With the growth of mobile phone sales, pre-etched windows and CO2 laser, UV, UV-YAG laser and combined UV-CO2 laser to form micro blind holes. Micro blind vias allow designers to route under the blind vias, so more pin grids can be redistributed without increasing the number of layers. HDI is currently widely used in three platforms: miniaturized products, high-end packaging and high-performance electronic products. Miniaturization in mobile phone design is currently the most productive application.
With the rapid development of electronic technology, only by recognizing the development trend of PCB technology, circuit board manufacturers can actively develop innovative production technology to find a way in the highly competitive PCB industry. As the world's largest producer of PCB boards, the production and processing capabilities of Shenzhen PCB manufacturers will become a key part of the development of the electronics industry. Circuit board manufacturers must always maintain the awareness of development. The following are some views on the development of PCB production and processing technology:
1. Develop component embedding technology
Component embedding technology is a huge change in PCB functional integrated circuits. The formation of semiconductor devices (called active components), electronic components (called passive components) or passive components on the inner layer of the PCB has begun. Production, but to develop circuit board manufacturers must first solve the analog design method, production technology and inspection quality, reliability assurance is also a top priority. PCB factories must increase resource investment in systems including design, equipment, testing, and simulation to maintain strong vitality.
2. HDI technology is still the mainstream development direction
HDI technology promotes the development of mobile phones, drives the development of information processing and control basic frequency functions of LSI and CSP chips (packages), and the development of template substrates for circuit board packaging. It also promotes the development of PCBs. Therefore, circuit board manufacturers must innovate along the HDI road. PCB production and processing technology. As HDI embodies the most advanced technology of contemporary PCB, it brings fine wire and tiny aperture to PCB board. HDI multi-layer board application terminal electronic products-mobile phones (mobile phones) is a model of HDI frontier development technology. In mobile phones, PCB motherboard micro-wires (50μm～75μm/50μm～75μm, wire width/spacing) have become the mainstream. In addition, the conductive layer and board thickness are thinner; the conductive pattern is refined, which brings high-density and high-performance electronic equipment .
Regarding the future business layout, Shen Qingfang said that 5G, biometrics, or pressure-sensitive, sensory automatic driving may be applied to Pengding Holdings’ circuit boards, or cloud storage, computing, base stations, etc., “This is our The step-by-step development layout will ultimately lead to a smart factory."
