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High-frequency circuit boards can be said to be quite high in terms of physical performance and accuracy, or in terms of technical parameters; it is a special circuit board with relatively high electromagnetic frequency. It is part of the main process of using these common rigid circuit board manufacturing research methods on the microwave base copper clad board or the circuit board produced by the company using a special data processing method. Generally speaking, a high-frequency board can be defined as a circuit board with a frequency above 1GHz.
It is becoming more and more common for current electronic information products to carry the functions of wireless network communication systems, and wireless data communication enterprise technology is realized by relying on the radio frequency circuit on the PCB, so high-frequency circuit boards are new in the e-commerce era. The rising star is beyond doubt. As time signals are transmitted through high-frequency and high-speed digitalization, PCBs are forced to move towards micro-holes and buried/blind vias, fine wires, and uniform thinning of dielectric layers. High-frequency, high-speed, high-density multilayer PCB design science and technology problems have become A very important area of our research work.
The high frequency PCB circuit power limit depends on the power level of the circuit heating temperature. The safety certification UL circuit material can also obtain the material's rated thermal index (RTI), which is the highest temperature at which the circuit material can work for a certain period of PCB time without deterioration. When the actual circuit is made on the substrate, other factors must be considered from the perspective of heat treatment.
The radio frequency microwave power of PCB is limited by the circuit principle and the circuit working environment. If the load power supply does not cause the circuit to heat up beyond the temperature of the circuit itself, the power supply level is acceptable. Of course, the power load will cause the circuit to heat up, causing the circuit temperature to exceed the ambient temperature. When the outside temperature is + 25 ° c, the heat generated by the loaded RF microwave power will not exceed the maximum temperature. When the circuit uses the same power level at an external temperature of +50 °c, the heat generated by the circuit may exceed the maximum power, causing problems in the circuit. As mentioned above, the power of the high-frequency PCB circuit also depends to a certain extent on the external working environment. In the new wave of localization of new electronic materials, high-frequency circuit boards will have the first mover advantage.
