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High frequency PCB board attention:
High-speed interconnect is one of the general purpose of all electronic devices, which is to ensure both high speed transmission speed and reliability are accurate connection. This requirement has led to equipment manufacturers are constantly looking for ways to bring faster data speeds in the semiconductor and PCB board.
From the angle of material RF, Rogers advanced circuit division board material in Asia market development manager Yang, compared with the past, devices radio frequency bandwidth spectrum and power has increased enormously, demands large bandwidth forcing designers should as far as possible the use of component and the performance of the substrate, therefore, will be an important performance consistency between modules; continuous increase of power output also make peripheral component not only meets the requirements of stable operation under high temperature environment, but also need to be aware of the additional heat function dissipation.In addition, halogen-free PCB materials has become a basic requirement for rf PCB material to reduce the impact on environment.To in short, the current market demand for PCB board is mainly reflected in three aspects, namely consistency, heat dissipation and environmental protection.
In order to adapt to the bandwidth and complexity, Rogers has been working on the development of materials with high thermal conductivity to reduce the impact of high temperatures. According to the introduction, launched by Rogers RO3035HTC material has a very low insertion loss under the premise of public 3.5dk and greatly improved thermal conductivity, which is suitable for high power RF applications and can be used in conjunction with a thermally conductive adhesive with high temperature characteristics.In addition, RO4360G2 materials with better thermal reliability can reduce the size of the RF antenna level RO4700JXR circuit.The improved laminate series is designed for base stations and other antenna with low-loss medium and low copper foil roughness, thereby reducing the effects of passive intermodulation (PIM) and achieve insertion loss low.
