PCB News - supply capacity of high-end HDI board​

supply capacity of high-end HDI board:

Overall, Flexible Circuit Board and Board High Density Interconnect (HDI) are two interesting points of the growth in PCB market in recent years. On the one hand, under the current trend of major brands rush to attack wearable electronics market, FPCB manufacturer has brought considerable business opportunities.On other hand, with the continuous improvement of the level of car electronics, the number of FPCB used in cars also on the rise .Driven by replacement effects 4G communication mobile terminal, a major manufacturer of high-end HDI board has been actively expanding production capacity to meet the rapidly increasing market demand.

Each layer of high density plate connections (Anylayer HDI) belongs to a class of high-end HDI process of making the board, and the difference between the general board HDI, HDI public directly by the drilling machine in the process of lining drilling PCB board between the layers and layers, and arbitrary layer HDI is connected between the laser drilling through layers and layers, the base material can be removed in the middle of a copper foil substrate, thereby making the product more frivolous.As high-end smartphones accounted for a growing proportion of overall mobile phone market, step by step in recent years, intelligent the phone design is gradually from high levels of HDI boards use layer HDI boards, but due to the high amount of investment, the yield is relatively difficult to control under the influence of such factors, some manufacturers have the technology, iPCB.com also can provide HDI circuit boards Anylayer the.

HDI mobile phone board technology and market development trend

With the development of mobile phone products with more and more functions and smaller sizes, the circuit design and process technology of mobile phone PCBs are becoming more and more sophisticated. Taiwan is the world's most important place for mobile phone board production. The development is also quite eye-catching. This article will introduce the current development of mobile phone PCB technology in depth and analyze the opportunities and challenges that Taiwan’s PCB industry faces in the global market.

Mobile phone board technology development trend

PCB (Printed Circuit Board) is the main support for the installation and interconnection of electronic components. According to the circuit design, the electrical wiring of the connected circuit parts is drawn into wiring patterns, and the use of mechanical processing and surface treatment In other ways, the electrical conductor is reproduced on the insulator. Since the quality of the circuit board will directly affect the reliability of the mobile phone, it is an indispensable key basic part of the mobile phone. With the increase of mobile phone functions, the complexity of the circuit design of mobile phones has also increased. In addition, consumers’ demand for light, thin, short and small mobile phones has increased, and the design of circuit boards has led to how to deploy more circuits per unit area to achieve The purpose of carrying more components.

Therefore, with the demand for lighter, thinner, shorter and smaller mobile phones, PCB technology levels continue to improve. The development process of Taiwan's mobile phone board technology is shown in (Figure 1), starting from the early interconnection practice of forming all boards at a time, and developing to the application of local interlayers. Blind/buried-hole boards manufactured by the technology of buried vias for internal vias and blind vias connected to the outer layer, all the way to high-density interconnect substrates (HDI) manufactured by non-mechanical vias. The early 6/6 (mils/mils) has progressed to 3/3～2/2 (mils/mils) of the current HDI board.

(Figure 1) Mobile version technology development trend