PCB News - The meaning of BGA in PCBA processing

What does bga mean?BGA meaning solder ball array package, is a type of chip package, package pins for the ball grid array at the bottom of the package, the pins are into a ball and arranged in a pattern similar to the lattice, thus named BGA.

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The full name of BGA in PCBA processing is Ball Grid Array (PCB with ball grid array structure), which is a packaging method for integrated circuits using organic substrates. It has: less packaging area; increased functions and increased number of pins; self-centering when the PCB board is melted and easy to tin; high reliability; good electrical performance and low overall cost. PCB boards with BGA generally have many small holes. Most customers' BGA vias are designed with a finished hole diameter of 8-12mil. The distance between the surface of the BGA and the hole is 31.5mil as an example, generally not less than 10.5mil. BGA via holes need to be plugged, BGA pads are not allowed to be filled with ink, and BGA pads are not drilled.

The generation of air bubbles during BGA welding is mainly due to the heat and pressure during the welding process, as well as the unreasonable design of the temperature profile. In order to minimize the generation of air bubbles, the following measures can be taken:

What are the causes of air bubbles during BGA welding?

The generation of air bubbles is mainly due to the heat and pressure during the soldering process. At high temperatures, the molten tin metal is pressurized, which produces small air bubbles, thus affecting the quality of the soldering.

How should I control the generation of air bubbles during the BGA soldering process?

Bubbles can be minimized by reducing the amount of heat and pressure applied during the soldering process. For example, high quality solder can be used to ensure that the heat and pressure during the soldering process is controlled within a certain range; the soldering temperature can also be adjusted to reduce the heat and pressure during the soldering process.

What should I pay attention to during the BGA soldering process?

In the BGA welding process, attention should be paid to selecting the appropriate welding temperature to ensure that the welding temperature is within a controlled range; in addition, high-quality solder should be selected to reduce the heat and pressure in the welding process to avoid the generation of bubbles.

The assembly of BGA devices in PCBA processing is a basic physical connection process. In order to be able to determine and control the quality of such a process, it is required to understand and test the physical factors that affect its long-term reliability, such as the amount of solder, the positioning of wires and pads, and wettability, otherwise it is attempted to be based solely on electronics The results of the test are modified, which is worrying. The performance and assembly of BGA devices are superior to conventional components, but many manufacturers are still unwilling to invest in the ability to develop mass production of BGA devices. The main reason is that it is very difficult to test the solder joints of BGA devices, and it is not easy to guarantee its quality and reliability.

What is BGA Fanout?

In PCB layout design, especially for BGA (Ball Grid Array), PCB fanout, pads and vias are particularly important. Fanout is the alignment from the device pads to the adjacent vias, as shown in the figure below.

Vias are the electrical connections between layers in a PCB and are used to connect inputs and outputs, power supplies, and ground tracks.

Typically, there is one vias per pad.The PCB pad is where the device solder balls are placed and soldered to. One of the important and difficult aspects of PCB design using fine pitch BGAs is the layout of the BGA pads and fanouts.

BGA Pad and Package

BGA packages are usually built around an inserter: a small printed circuit board that serves as an interface between the actual chip and the board on which it is mounted. The chip is bonded to the intermediary layer by leads and covered with protective epoxy.

The inserter routes signals from the edge of the chip to an array of pads on the bottom, to which small solder balls are attached. The completed BGA package is then placed on a printed circuit board and heated, the solder balls melt and create a connection between the board and the interposer.

Different BGA types: Classic BGA (272-pin, 1.27 mm pitch), Chip Level Package (49-pin, 0.65 mm pitch) and Wafer Level Chip Level Package (20-pin, 0.4 mm pitch).

The marketing names for the different BGA type packages are varied and largely unstandardized.

InPCBA processing,BGA devices can consistently achieve a defect rate of less than 20 (PPM) when using conventional SMT process procedures and equipment for assembly and production. Since the beginning of the 1990s,SMT technology has entered a mature stage. However, with the rapid development of electronic products in the direction of convenient/miniaturization, networking and multimedia,higher requirements have been put forward for electronic assembly technology. Density assembly technologies continue to emerge, among which BGA (Ball Grid Array package) is a high-density assembly technology that has entered the practical stage.Our factory is located in China. For decades,Shenzhen has been known as the world's electronics R&D and manufacturing center.Our factory and website are approved by the Chinese government,so you can skip the middleman and buy products on our website with confidence. Because we are a direct factory,this is the reason why 100% of our old customers continue to purchase on iPCB.