PCB News - Characteristics of BGA in PCBA processing

Characteristics of BGA in PCBA processing
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If the PCB factory is determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and the PCB factory can get the opportunity to develop again.
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields.
Features of BGA in PCBA processing:
1. Less packaging area;

2. The function is increased, and the number of pins is increased;
3. The PCB board can be self-centered during melting and soldering, and it is easy to be tinned;

4. High reliability, good electrical performance and low overall cost.

PCBA-processed PCB boards with BGA generally have many small holes. Most customers’ BGA vias are designed with a finished hole diameter of 8-12 mils. The distance between the surface of the BGA and the hole is 31.5 mils as an example, generally not less than 10.5 mils . BGA via holes need to be plugged, BGA pads are not allowed to be filled with ink, and BGA pads are not drilled.

In PCBA processing, BGA devices can consistently achieve a defect rate of less than 20 (PPM) when using conventional SMT process procedures and equipment for assembly and production. SMT technology has entered a mature stage since the 1990s. However, with the rapid development of electronic products in the direction of convenience/miniaturization, networking and multimedia, higher requirements have been placed on electronic assembly technology. Density assembly technologies continue to emerge, among which BGA (Ball Grid Array package) is a high-density assembly technology that has entered the practical stage. iPCB is happy to be your business partner. Our business goal is to become the most professional prototyping PCB manufacturer in the world. With more than ten years of experience in this field, we are committed to meeting the needs of customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requirements. As one of the most experienced PCB manufacturers and SMT assemblers in China, we are proud to be your best business partner and good friend in all aspects of your PCB needs. We strive to make your research and development work easy and worry-free.
quality assurance
iPCB has passed ISO9001:2008, ISO14001, UL, CQC and other quality management system certifications, produces standardized and qualified PCB products, masters complex process technology, and uses professional equipment such as AOI and Flying Probe to control production and X-ray inspection machines. Finally, we will use double FQC inspection of appearance to ensure shipment under IPC II standard or IPC III standard.