PCB News - Analyze the new item of PCBA board

Analyze the new item of PCBA board
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields. From this point of view, the environmental protection problems of PCB factories can be solved from the following two points.
PCBA board refers to a PCB board with components already soldered. For its new development projects, more complex, larger PCBA boards and tighter packaging are required.

These requirements challenge our ability to build and test these units. Furthermore, larger circuit boards with smaller components and higher node counts may continue. For example, a design that is currently drawing a circuit board diagram has about 116,000 nodes, more than 5,100 components, and more than 37,800 solder joints that require testing or verification. This unit also has BGA on the top and bottom surfaces, and the BGA is next to each other. Using a traditional needle bed to test a board of this size and complexity, a method of ICT is impossible.

In the manufacturing process, especially in testing, the increasing complexity and density of PCBA boards is not a new issue. Realizing that increasing the number of test pins in the ICT test fixture is not the way to go, we began to observe alternative circuit verification methods. Looking at the number of non-contact probes per million, we found that at 5000 nodes, many of the errors found (less than 31) may be due to probe contact problems rather than actual manufacturing defects.
Therefore, we set out to reduce the number of test needles instead of increasing them. Nevertheless, the quality of our manufacturing process is evaluated to the entire PCBA board. We decided that the combination of traditional ICT and X-ray layering is a feasible solution.
The above is the sharing of this issue. If you want to know more information, please continue to pay attention to more exciting content in the later period of the PCBA board editor. Pay attention to product innovation in terms of energy saving and emission reduction.PCB factories must learn to attach importance to Internet technology and realize the practical application of automated monitoring and intelligent management in production through the integration of overall industry knowledge.