PCB News - How Much Do You Know About The History Of PCBA

PCBA has been developed for many years, and its appearance is another important invention in our human history.Human beings invented technology, and technology promoted science and technology, which led to today's developed and convenient life.It is reasonable for us to know how PCBA has developed up to now, and we should thank our excellent predecessors.

In 1941, the United States painted talc with copper paste for wiring to make proximity fuse.

In 1943, the Americans popularized the technology in military radios.

In 1947, epoxy resin was used to make substrates.At the same time, NBS began to study the manufacturing technology of coils, capacitors and resistors formed by printing circuit technology.

In 1948, the Invention was officially approved for commercial use in the United States.

It was only in the 1950s, when vacuum tubes were largely replaced by low-heat transistors, that printed circuit boards began to be widely adopted.At that time, etching foil film technology was the mainstream.

In 1950, Japan used silver paint for wiring on glass substrates;And paper phenolic resin phenolic substrate (CCL) with copper foil as wiring.

In 1951, polyimide was introduced to make the resin even more heat-resistant, and polyimide substrate was also made.

In 1953, Motorola developed the electroplating through hole method of double panel.This method is also applied to the later multi-layer circuit board.Printed circuit boards were widely used for 10 years in the 1960s, and their technology became increasingly mature.And since Motorola's double - panel, multi - layer printed circuit board began to appear, so that wiring and substrate area ratio is more improved.

In 1960, V. Dahlgreen made a flexible printed circuit board by attaching a foil film with a circuit printed on it to thermoplastic plastic.

In 1961, the Hazeltine Corporation, based in the United States, introduced the electroplating perforation method to produce multilayered plates.

In 1967, the Plated-up Technology was published as one of the layering methods.

In 1969, FD-R manufactured flexible printed circuit boards with polyimide.

In 1979, Pactel published one of the lay-up methods, "Pactel method ".

In 1984, NTT developed the "Copper Polyimide method "for thin-film circuits.

In 1988, Siemens Ag developed an extended printed circuit board for Microwiring Substrate.

In 1990, IBM developed the Surface Laminar Circuit (SLC) for its extended printed Circuit board.

In 1995, Matsushita Electric Developed ALIVH's extended layer printed circuit board.

In 1996, Toshiba developed B2it's extended layer printed circuit board.

History is advancing, technology is advancing, we should keep moving forward, but don't forget to have the technology.