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PCB News - How to improve the soldering method of PCBA board?

PCB News

PCB News - How to improve the soldering method of PCBA board?

How to improve the soldering method of PCBA board?

2021-10-02
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Author:Frank

How to improve the soldering method of PCBA board?
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If the PCB factory is determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and the PCB factory can get the opportunity to develop again.
In the PCBA processing process, there are many production processes, which are prone to many quality problems. At this time, it is necessary to continuously improve the PCBA welding method and improve the process to effectively improve the product quality.
1. Improve the temperature and time of welding
The intermetallic bond between copper and tin forms crystal grains. The shape and size of the crystal grains depend on the duration and strength of the temperature during welding. Less heat during welding can form a fine crystalline structure, forming an excellent welding point with the best strength. PCBA patch processing reaction time is too long, whether it is due to too long welding time or due to high temperature or both, it will lead to a rough crystalline structure, which is gritty and brittle, and has relatively high shear strength. small.

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2. Reduce surface tension
The cohesion of tin-lead solder is even greater than that of water, so that the solder is spherical to minimize its surface area (under the same volume, the sphere has the smallest surface area compared with other geometric shapes to meet the needs of the lowest energy state) . The effect of the flux is similar to the effect of the cleaner on the grease-coated metal plate.In addition, the surface tension is also highly dependent on the cleanliness and temperature of the surface. Only when the adhesion energy is much greater than the surface energy (cohesion) can ideal adhesion occur. tin.
Three, PCBA board dip tin corner
When the eutectic point temperature of solder is about 35°C higher, when a drop of solder is placed on a hot flux-coated surface, a meniscus is formed. To a certain extent, the ability of the metal surface to dip tin It can be evaluated by the shape of the meniscus. If the solder meniscus has an obvious undercut edge, shaped like a drop of water on a greased metal plate, or even tends to be spherical, the metal is not weldable. Only the meniscus stretched to a size less than 30. It has good weldability at a small angle.
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