PCB News - Common faults and solutions for metallization of circuit board factory holes

Do you all know the process flow of the circuit board factory? We often hear the term hole metallization, so when a circuit board factory makes a circuit board, there will be many processes, so what are the common faults and troubleshooting methods of hole metallization? The editors below will share with you one by one.

Causes and solutions for the failure of metallization of circuit board factory holes:

1. The backlight is unstable, and the hole wall has no copper

1. The composition of the chemical copper working fluid is out of adjustment or the process conditions are out of control

2. The regulator is missing or ineffective

3. Activator composition or low temperature

4. Overspeeding

5. Different plates, too strong de-drilling

6. The inner layer of the hole wall is broken or peeled off when drilling

So how do circuit board manufacturers improve?

1. Adjust the components and process conditions of the working fluid, especially increase the HCHO content, appropriately increase the temperature or reduce the addition of stabilizer-containing components, and increase the activity of the working fluid.

2. Add or replace the regulator at normal temperature

3. Replenish activator and increase the temperature

4. Reduce the concentration of quickening agent or soaking time

5. Appropriately reduce the strength of de-drilling and increase the activity of activator and chemical copper solution

6. Improve the quality of drill bits, plates and blackening treatment

2. There is no copper on the hole wall after electroplating

1. Chemical copper is too thin to be oxidized

2. Too strong micro-etching before plating

3. There are bubbles in the hole in the plating

solution:

1. Increase the copper thickness of this school

2. Adjust the strength of micro-etching

3. No filtration of activator working fluid

4. Filter the working fluid, adjust the composition of the working fluid, and adjust the temperature