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PCB common standards

PCB manufacturers: 1) IPC-ESD-2020: Joint standard for the development of electrostatic discharge control procedures. Including all necessary planning, establishment, completion and protection of electrostatic discharge control procedures. According to the historical experience of certain military organizations and commercial organizations, provide instruction for handling and protection of electrostatic discharge sensitive periods.

2) IPC-SA-61 A: Semi-aqueous cleaning manual after welding. Including all aspects of semi-aqueous cleaning, including chemical, produced residues, equipment, technology, process control, and environmental and safety considerations.

3) IPC-AC-62A: Water into the cleaning manual after welding. Describe the cost of manufacturing residues, the type and nature of aqueous cleaning agents, the process of aqueous cleaning, equipment and craftsmanship, quality control, environmental control, employee safety, and cleanliness measurement and measurement.

4) IPC-DRM -4 0E: For through-hole solder joints, please refer to the manual on the desktop. According to the requirements of the standard, the detailed description of components, hole walls and welding surface cover, etc., also includes 3D graphics generated by the computer. Covers tin filling, contact angle, tin dip, vertical filling, solder pad masking, and many solder joint defects.

5) IPC-TA-722: Welding Technology Review Manual. Includes 45 articles on all aspects of soldering technology, covering general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering and infrared soldering.

6) IPC-7525: Strategy for template planning. Supply and instruction policy for the planning and manufacturing of solder paste and surface mount adhesive coating templates. I also talked about template planning using surface mount technology, and introduced the use of through-hole or flip chip components. Technology, including overprinting, double printing and staged template planning.

7) IPC/EIA J-STD-004: Standard requirements for flux include Appendix I. Including the technical guidelines and classification of rosin, resin, etc., organic and inorganic fluxes classified according to the content of halides in the flux and the degree of activation; also including the use of flux, substances containing flux, and low levels used in the no-clean process Flux residue.

8) IPC/EIA J-STD -005: Standard requirements for solder paste include Appendix I. Lists the characteristics and technical policy requirements of solder paste, as well as inspection methods and metal content standards, as well as viscosity, collapse, solder ball, viscosity and solder paste dipping function.
9) IPC/EIA J-STD-0 06A: Standard requirements for electronic grade solder alloy, flux and non-flux solid solder. For electronic grade solder alloys, rod, ribbon, powdered flux and non-flux solder, for the use of electronic solder, and provide terminology, standard requirements and inspection methods for special electronic grade solder.
10) IPC-Ca-821: General requirements for thermally conductive adhesives. Including the requirements and inspection methods for thermally conductive dielectrics that bond the components to the appropriate position.
11) IPC-3406: A guide to coating adhesives on conductive surfaces. Provides guidance on the selection of conductive adhesives as an alternative to solder in electronic manufacturing.
12) IPC-AJ-820: Assembly and welding manual. Including the description of assembly and soldering inspection technology, including terms and definitions; printed circuit boards, components and pin types, solder joint materials, components and equipment, planning standards and guidelines; soldering technology and packaging; Cleaning and laminating; quality assurance and inspection.
13) IPC-7530: A guide to the temperature profile of the batch soldering process (reflow soldering and wave soldering). Various inspection methods, techniques and methods are selected in the acquisition of temperature curves to provide guidance for establishing the best graphics.
14) IPC-TR-460A: Printed circuit board wave soldering defect cleaning list. A list of recommended correction methods for defects that may be caused by wave soldering.
15) IPC/EIA/JEDEC J-STD-003A. Solderability inspection of printed circuit boards.
16) J-STD-0 13: Application of SGA and other high-density technologies. Establish the standard requirements and interactions required for the printed circuit board packaging process, and provide information for the interconnection of high-function and high-pin-count integrated circuit packaging, including planning principle information, material selection, board manufacturing and assembly technology, and inspection methods And according to the reliability expectations of the final operating environment.
17) IPC-7095: SGA device planning and assembly process compensation. Provide various useful operating information for people who are using SGA devices or considering switching to the field of array packaging methods; provide instruction for SGA inspection and repair and provide reliable information about the SGA field.
18) IPC-M-I08: Cleaning instruction manual. Including the latest version of other IPC cleaning instructions, providing assistance to manufacturing engineers when they decide on the cleaning process and defect cleaning of the product.
19) IPC-CH-65-A: Cleaning strategy in printed circuit board assembly. It provides references for current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, and explains the connections between various materials, processes, and contaminants in manufacturing and assembly operations.
20) IPC-SC-60A: Manual of solvent cleaning after soldering. The application of solvent cleaning technology in automatic welding and manual welding is given, and the nature of solvents, residues, process control and environmental issues are discussed.
21) IPC-9201: Surface Insulation Resistance Handbook. It includes the terminology, theory, inspection process and inspection methods of surface insulation resistance (SIR), as well as temperature and humidity (TH) inspection, defect methods and defect cleaning.
22) IPC-DRM-53: Refer to the manual for the electronic assembly desktop. Illustrations and photos used to illustrate the technology of through-hole devices and surface mount devices.
23) IPC-M-103: Surface Mount Equipment Manual Standard. This section includes all 21 IPC files related to surface mount.
24) IPC-M-I04: Printed circuit board assemblymanual standard. Includes the 10 most widely used documents related to printed circuit board assembly.
25) IPC-CC-830B: The function and determination of electronic insulating compounds in printed circuit board assembly. The protective coating meets an industry standard for quality and qualification.
26) IPC-S-816: Surface mount technology process strategy and list. This defect cleaning strategy lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, missing soldering, and uneven placement of components.
27) IPC-CM-770D: Strategy for printed circuit board components and equipment. Provide useful teachings for the preparation of components in printed circuit board assembly, and recall related standards, influence and distribution, including assembly technology (including manual and automatic, surface mount technology and flip chip assembly technology ) And consideration of subsequent welding, cleaning and coating processes.
28) IPC-7129: Defects per million opportunities (DPMO) accounting and printed circuit board assembly manufacturing policy. A benchmark policy that is unanimously agreed by industry departments related to accounting for defects and quality; it provides a satisfactory method for accounting for the benchmark policy for the number of defects per million opportunities.
29) IPC-9261: Estimated output of printed circuit board assemblies and defects per million opportunities during assembly. It defines a reliable method for calculating the number of defects per million opportunities in the process of printed circuit board assembly, and is a measure of evaluation at each stage of the assembly process.
30) IPC-D-279: Reliable surface mount technology printed circuit board assembly planning strategy. Reliability manufacturing process strategy for printed circuit boards of surface mount technology and hybrid technology, including planning ideas.
31) IPC-2546: Printed circuit board assembly conveys key combination requirements. Depicts material movement systems, such as actuators and buffers, manual placement, automatic screen printing, automatic adhesive dispensing, automatic surface mount placement, automatic plated through-hole placement, forced convection, infrared reflow oven, and wave soldering.
32) IPC-PE-740A: Defect cleaning in printed circuit board manufacturing and assembly. Including printed circuit products in the planning, manufacturing, equipment and inspection process of the case records and correction activities.
33) IPC-6010: Printed circuit board quality standard and function standard series manual. Including the quality standards and functional standards formulated by the American Printed Circuit Board Association for all printed circuit boards.
34) IPC-6018A: Inspection and inspection of printed circuit boards for microwave products. Including the function and qualification requirements of high-frequency (microwave) printed circuit boards.
35) IPC-D-317A: Selection of high-speed technology electronic packaging planning guidelines. Provide guidance for the planning of high-speed circuits, including mechanical and electrical considerations and functional tests.