PCB News - iPhone 8 is rumored to use RFPCB

iPhone 8 is rumored to use RFPCB
The key components of Apple's iPhone 8 are coming out. South Korean media reported that the iPhone 8 may use a soft and hard board RFPCB. Apple plans to order 100 million pieces this year and spend tens of millions of dollars to purchase equipment to lease to suppliers to ensure that the supply is safe.
According to reports, for rigid flexible printed circuit boards (rigid flexible printed circuit boards), Apple recently purchased expensive mass-produced equipment, with a purchase scale of up to tens of millions of dollars.
The report pointed out that the Rigid-Flex PCB (Rigid-Flex PCB) is the key component of the upcoming organic light-emitting diode (OLED) version of the iPhone. It is mainly used to connect the chip to the key component between the display screen and the camera lens.
The report pointed out that Apple does not have a manufacturing plant for related equipment. What is important is that Apple has planned to purchase RFPCB products from three suppliers to ensure that the supply is safe.

The report quoted industry sources as saying that Apple is leasing related equipment to suppliers to ensure that RFPCB products can meet the needs.
The report and quoting an anonymous person said that among the three suppliers, one of the Taiwanese manufacturers withdrew from the ranks of supplying RFPCB due to the difficult emergency situation of production and Apple's strict quality requirements but low profitability.
The report pointed out that Apple may use RFPCB components in the upcoming iPhone 8 products. Apple plans to order 100 million RFPCBs this year, which will be supplied by two other Korean suppliers Interflex and Youngpoong Electronics (Youngpoong Electronics).
Analysts recently predicted that Apple expects to launch three iPhones in the second half of this year, including a newly designed 5.2-inch (or 5.8-inch, depending on the definition of the usage area) OLED version of the iPhone, and a 4.7-inch and 5.5-inch LCD iPhone in two sizes.
In terms of main functions, the report pointed out that these three new iPhones all use a metal frame integrated glass case design, in which the OLED model uses stainless steel, and the LCD model uses an aluminum frame; in addition, they all support WPC standard wireless charging.
The report expects that the OLED version of the iPhone will climb from October to November; the LCD version of the iPhone will climb from August to September.
Analysts pointed out that the OLED version of the iPhone’s 3D sensing components have very high quality standards, which has also increased the difficulty of related hardware production and software design.
iPCB has passed ISO9001:2008, ISO14001, UL, CQC and other quality management system certifications, produces standardized and qualified PCB products, masters complex process technology, and uses professional equipment such as AOI and Flying Probe to control production and X-ray inspection machines. Finally, we will use double FQC inspection of appearance to ensure shipment under IPC II standard or IPC III standard.