PCB News - The future growth of PCB products and the demand for copper-plated phosphor copper anode materials

The future growth of PCB products and the demand for copper-plated phosphor copper anode materials
1. The growth of PCB products in the future
PCB copper electroplating process, using sulfate system copper plating has the advantages of simple process, convenient operation and stable product quality. With the continuous updating of electronic products, more functions and smaller volume, higher requirements are put forward on printed circuit boards. From the perspective of product level, the output value of HDI boards, IC substrates, flexible boards, and rigid-flex boards has accounted for 43.7% of the global output value, and the global demand for high-end PCBs is still increasing.
The demand for microcrystalline phosphor copper anode materials for high-grade PCB growth will also increase simultaneously. At present, HDIPCB and flexible boards in Mainland China have steadily ranked first in the world, accounting for 39.2% and 30.7% of the global HDI output value. This shows that the technical level of PCB in Mainland China has improved to a certain extent; although the most technological Difficulty 10: The carrier board and rigid-flex board are still in the hands of Japanese, Taiwanese, and Korean companies; especially in the manufacturing of carrier boards, Japanese companies account for 4,497 of the global output value. ; However, with the advancement of PCB manufacturing technology in mainland China, these high-grade? The growth will be the fastest. In 2009/2010, the output value of China's mainland area increased by 29.87. It is the fastest growing in other countries and regions.

It is estimated that in the next 5 years, the compound annual growth of PCB output value in mainland China will reach 10.8%.
The future demand for copper-plated anode materials has now become a major PCB manufacturing country.
2. Low-phosphorus microcrystalline copper anode is the direction of future development
In the sulfate electroplating system, the phosphorus in the phosphorous copper anode can form a black film on the surface of the anode, which plays a very important role in preventing the production of the copper anode. However, the presence of phosphorus as an "impurity", due to the presence of free phosphorus (from the dissolution process of phosphorous copper) in the plating solution, will more or less be deposited in the copper plating layer, which affects the ductility of the copper plating layer. How to solve these problems caused by high-phosphorus copper anodes? Microcrystalline phosphor copper anodes, due to the small crystal grains and uniform phosphorus distribution on the surface of the crystallites, low phosphorus content can form a black film on the surface of the crystallites, which can prevent 01+ The formation can reduce the influence of "phosphorus" on the coating. Therefore, the microcrystalline phosphor copper anode is the development direction of copper-plated anode materials in the high-grade, high-demand PCB manufacturing process.
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