PCB News - The development prospects of ceramic pcb

The development prospects of ceramic PCB
With the development of society, the progress of industry, the refinement of craftsmanship, the development of PCB industry is getting better and better, and the craftsmanship is becoming more and more advanced. Whether it is a hard board or a soft board, a combination of soft and hard, or a ceramic substrate with the best heat dissipation performance, it is telling us that there is no limit to innovation!
At present, the more mature ceramic substrates include alumina ceramic circuit boards and aluminum nitride ceramic circuit boards. Many companies can do 3535, 5050, 7070, etc., and R&F Tiansheng Technology (Wuhan) Co., Ltd. can accept customer customization, regardless of Any specification can be made, but the line spacing must be greater than 20 microns, and the fully automated production is adopted, which does not require too much manpower and avoids many process errors.

Such a sunrise enterprise that values scientific research and technology and user experience not only provides corresponding guarantees for employees, but also provides customers with a more comprehensive and mature user experience. For possible problems such as copper splashing, falling off and bubbles, Stone The technology is also quite mature. The general requirement of the circuit board industry is that the bonding force can reach 18-30 MPa, and the shedding is due to the insufficient bonding strength. The bonding strength of our products is 45 MPa, that is, the thrust value and the tension value are both 45 MPa. MPa, so it will not fall off after welding. It also uses LAM laser activation technology. The thickness of the copper coating can be made 0.001-1mm according to the customer's needs. Generally, the copper coating is 0.03mm, with an error of +/-0.005mm, and the copper conductivity will not burn out in the later stage. Such products mainly exist in products that require high heat dissipation requirements, such as general aerospace, automotive electronics, lighting, and high-power electronic components to maximize product performance.
Our laser rapid activation metallization technology (LAM) is at the leading level in the global ceramic PCB industry, and can be customized quickly to meet customer needs. Ceramic-based metallized substrate has good thermal and electrical properties. It is an excellent material for power LED packaging, violet light, and ultraviolet. It is especially suitable for packaging structures such as multi-chip packaging (MCM) and substrate direct bonding chip (COB). At the same time, it can also be used as the heat dissipation circuit substrate of other high-power power semiconductor modules, high-current switches, relays, antennas, filters, and solar inverters in the communications industry.
The ceramic PCB industry is estimated to have a market value of 6 billion U.S. dollars in the smart lighting market, and it will beat most of the "sunrise industry" at an annual growth rate of 7%, and become an emerging high-tech enterprise in the industry. It is widely used in energy vehicles and other aspects.
In today's broad market prospects, R&F Tiansheng focuses on producing world-class quality ceramic substrates, enhancing brand influence, focusing on scientific research and development and high-tech applications, and providing you with timely, caring and cost-effective services.