PCB News - Why is the price of multi-layer circuit boards more expensive than ordinary circuit boards. What are the difficulties in the production process?

Why is the price of multi-layer circuit boards more expensive than ordinary circuit boards. What are the difficulties in the production process?

As we all know, the cost of making multilayer circuit boards is much higher than that of single and double boards. why? This is because as the number of layers of the circuit board increases, the manufacturing difficulty will increase and the cost will also increase. Next, "Why are multilayer circuit boards expensive? What are the difficulties in the production process? As a circuit board manufacturer, the editor summarized the following four points to share with you.
1. Difficulties in dimensional tolerance control
Due to the large number of middle layers of multi-layer circuit boards, users have higher and higher requirements for the calibration of the PCB layer. Generally, the alignment between layers is limited to 75 microns. Taking into account the large size of the multi-layer circuit board unit, the high temperature and humidity in the graphics transmission workshop, the accumulation of dislocations caused by the inconsistency of different core boards, and the positioning method between layers, the control becomes more and more difficult.

2. Difficulties in making internal circuits

Multilayer boards are made of special materials, such as high tg, high speed, high frequency, thick copper, and thin dielectric layers. The integrity of impedance signal transmission makes it difficult to manufacture internal circuits.

3. Difficult to compress and manufacture

The inner core board and the pre-cured board are superimposed in many places, and the slide plate is easy to appear in the stamping production. Laminating, resin gaps, air bubbles and other defects. In the design of the laminated structure, the heat resistance of the material should be fully considered. The pressure resistance contains the amount of glue and the dielectric thickness, and a reasonable pressing plan for multilayer circuit board materials has been established.

Due to the large number of layers, the expansion and contraction control and dimensional coefficient compensation are inconsistent, and the interlayer insulation layer is prone to fail the interlayer reliability test.
4. Difficult to drill
High tg, high speed, high frequency and thick copper plate increase the difficulty of drilling roughness burr and defogging. The number of layers is large, the total thickness of copper and the thickness of the board are accumulated, and the hole is easy to be broken; the inclined drill is easily caused by the thickness of the board.
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