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In the circuit board manufacturing process, what is solder mask? What is flux? And what is the difference between the two? In general, the solder assembly layer is mainly to prevent the copper foil of the circuit board from being directly exposed to the air, and play a protective role, while the soldering layer is used as a steel mesh, and the solder paste can be accurately placed when the tin is applied. To the patch pad that needs to be soldered.
The difference between the solder mask and the solder flux layer of the circuit board
The resist pad is the solder resist layer, which refers to the part of the PCB to be painted with green oil. In fact, this solder mask uses a negative output, so after the shape of the solder mask is mapped to the board, the solder mask is not painted with green oil, but the copper skin is exposed. Usually in order to increase the thickness of the copper skin, the solder mask is used to scribe lines to remove the green oil, and then tin is added to increase the thickness of the copper wire.
The soldering layer is used when the machine is patching. It corresponds to the pad of the patch component. In SMT processing, a steel plate is usually used, and the PCB corresponding to the component pad is punched, and then solder paste is placed on the steel plate., When the PCB is under the steel plate, the solder paste leaks, and it happens that every pad can be stained with solder, so usually the solder mask cannot be larger than the actual pad size.
The difference between the soldering layer and the solder mask of the circuit board
Both layers are used for soldering. It does not mean that one is soldered and the other is green oil, but:
1. The soldering layer is used for SMD packaging.
2. By default, the areas without solder mask must be painted with green oil;
3. The solder mask means to open a window on the green oil of the whole solder mask, the purpose is to allow welding;
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